Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927920 ◽

2002 ◽

Author(s):

Se-Young Jang ◽

J. Wolf ◽

O. Ehrmann ◽

H. Gloor ◽

H. Reichl ◽

...

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