Analytical model to study interfacial delamination propagation in a multi-layered electronic packaging structure under thermal loading

2002 ◽  
Author(s):  
H. Hu ◽  
W. Xie ◽  
S. Sitaraman
Keyword(s):  
Analytical Model ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Interfacial Delamination ◽  
Packaging Structure ◽  
Delamination Propagation

Interfacial Delamination Propagation in Multi-Layered High-Density Wiring Electronic Packaging Structures

2000 ◽  
Author(s):  
Hurang Hu ◽  
Weidong Xie ◽  
Suresh Sitaraman
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Analytical Model ◽  
Elastic Material ◽  
Release Rate ◽  
Material Properties ◽  
Electronic Packaging ◽  
Base Layer ◽  
Interfacial Delamination ◽  
Delamination Propagation

Abstract One of the most common failure modes in multi-layered electronic packaging structures is interfacial delamination. The objective of this research is to examine the possibilities of interfacial delamination in a next-generation electronic packaging structure under thermal loading. A sophisticated analytical model has been developed to determine energy release rate and stress intensity factor for delamination propagation. The model takes into consideration the temperature-dependent material properties as well as direction-dependent material properties. Although delamination between two adjacent layers is studied, the model takes into consideration the effect of all dielectric, metallization, and substrate layers in the multi-layered structure. Assuming that an initial delamination exists between the base layer and the Copper metallization layer, the present work studies the propagation of delamination. In the analytical model, the base layer is modeled as an orthotropic thermo-elastic material. Copper and the polymer dielectric materials are modeled as isotropic thermo-elastic material. For the Copper/base layer interface, the variation of bimaterial constant (ε) with temperature is obtained through the analytical model. The effect of some key parameters, such as materials Young’s modulus, coefficient of thermal expansion, and the base layer thickness on energy release rate is presented. Design recommendations for improved thermo-mechanical reliability are proposed.

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

1996 ◽  
Vol 118 (4) ◽  
pp. 206-213 ◽  
Author(s):  
K. X. Hu ◽  
C. P. Yeh ◽  
X. S. Wu ◽  
K. Wyatt
Keyword(s):  
Thin Film ◽  
Phase Angle ◽  
Structural Reliability ◽  
Thermal Loading ◽  
Multichip Module ◽  
Crack Model ◽  
Element Analysis ◽  
Delamination Growth ◽  
Interfacial Delamination ◽  
Functional Behavior

Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis to allow for accurate numerical evaluation of the magnitude and phase angle of the complex stress intensity factor. Under the assumption of quasi-static delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and loading phase angle over the history of delamination growth. This functional behavior is numerically obtained for a typical MCM/TFI structure with delamination along die and via base, subjected to thermal loading condition. The effect of delamination interactions on the structural reliability is also investigated. It is observed that the delamination along via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model

2019 ◽  
Vol 35 (6) ◽  
pp. 829-837 ◽  
Author(s):  
P. H. Chou ◽  
K.N. Chiang ◽  
Steven Y. Liang
Keyword(s):  
Neural Network ◽  
Artificial Neural Network ◽  
Regression Model ◽  
Electronic Packaging ◽  
Design Parameters ◽  
Simulation Technology ◽  
Wafer Level ◽  
Structure Reliability ◽  
Artificial Neural ◽  
Packaging Structure

ABSTRACTFor electronic packaging structure, there are many design parameters that will affect its reliability performance, using experimental way to obtain the reliability result will take a considerable amount of time. Therefore, how to shorten the design time becomes a critical issue for new electronic packaging structure development. This research will combine artificial intelligence (AI) and simulation technology to assess the long-term reliability of wafer level packaging (WLP). A simulation technology using finite element method (FEM) with appropriate mechanics theories has been validated by multiple experiments will replace the experiment to create reliability results for different WLP structures. After a big WLP structure-reliability database created, this study will apply artificial neural network (ANN) theory to analyze this database and obtains a regression model for structure-reliability relationship of WLP. Once the regression model is established and validated, the WLP geometry, such as pad size, die and buffer layer thickness, and solder volume, etc. can be simply entered, and then the WLP reliability results can be immediately obtained through the ANN regression model.

A Novel Silicon Base Piezoresistive Pressure Sensor Using Front Side Etching Process

2003 ◽  
Author(s):  
Chih-Tang Peng ◽  
Ji-Cheng Lin ◽  
Chun-Te Lin ◽  
Kuo-Ning Chiang ◽  
Jin-Shown Shie
Keyword(s):  
Pressure Sensor ◽  
Thermal Loading ◽  
Fabrication Process ◽  
Back Side ◽  
The Novel ◽  
Front Side ◽  
Sensor Performance ◽  
Novel Structure ◽  
Piezoresistive Pressure Sensor ◽  
Packaging Structure

By applying the etching via technology, this study proposes a novel front-side etching fabrication process for a silicon based piezoresistive pressure sensor to replace the conventional backside bulk micro-machining. The distinguishing features of this novel structure are chip size reduction and fabrication costs degradation. In order to investigate the sensor performance and the sensor packaging effect of the structure proposed in this research, the finite element method was adopted for analyzing the sensor sensitivity and stability. The sensitivity and the stability of the novel sensor after packaging were studied by applying mechanical as well as thermal loading to the sensor. Furthermore, the fabrication process and the sensor performance of the novel pressure sensor were compared with the conventional back-side etching type pressure sensor for the feasibility validation of the novel sensor. The results showed that the novel pressure sensor provides better sensitivity than the conventional one, and the sensor output signal stability can be enhanced by better packaging structure designs proposed in this study. Based on the above findings, this novel structure pressure sensor shows a high potential for membrane type micro-sensor application.

Thermal Stress Analysis of Thermally-Enhanced Plastic Ball Grid Array Electronic Packaging

2002 ◽  
Vol 18 (1) ◽  
pp. 9-16 ◽  
Author(s):  
Meng-Kao Yeh ◽  
Kuo-Ning Chiang ◽  
Jiann-An Su
Keyword(s):  
Thermal Stress ◽  
Thermal Cycling ◽  
Heat Sink ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Ball Grid Array ◽  
Geometric Parameters ◽  
Heat Sinks ◽  
Shear Stresses ◽  
Adhesive Layers

ABSTRACTThe thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cycling and thermal loading was investigated numerically. Two-dimensional finite element analysis by ANSYS was used for calculating the temperature distribution and thermal stress on the symmetric and diagonal cross sections of TEBGA. The thermal failure based on the peel and shear stresses at interfaces of TEBGA took place at the interface between the heat sink and epoxy moulding compound. The Tasi-Hill failure criterion was modified to predict the failure at various interfaces in TEBGA package. The TEBGA geometric parameters, including the thickness of the heat sink, the thickness of the adhesive layer between the heat sink and the die, and the thickness of the reinforcing copper ring, were varied to assess their effects on the failure mode of TEBGA. The results showed that for a TEBGA under thermal cycling, the stress values were reduced for thicker adhesive layers and thinner heat sinks; for a TEBGA under thermal loading, the die-to-ambient thermal resistance of TEBGA decreased for thinner adhesive layers and thicker heat sinks. The slimmer heat sink of extruded plate type can dissipate more heat and can reduce the stress values. Proper choice of geometric parameters of TEBGA package can prevent its failure at interfaces and furthermore, improve the reliability of electronic packaging.

Characterization and Modeling of Thermal Buckling in Eccentrically Loaded Microfabricated Nickel Beams for Adaptive Cooling

2005 ◽  
Author(s):  
Matthew McCarthy ◽  
Nicholas Tiliakos ◽  
Vijay Modi ◽  
Luc Freche´tte
Keyword(s):  
Closed Form ◽  
Analytical Model ◽  
Thermal Loading ◽  
Thermal Buckling ◽  
Design Parameters ◽  
Experimental Measurements ◽  
Test Results ◽  
Actuation Mechanism ◽  
Highly Nonlinear ◽  
Form Model

The design, fabrication and testing of micromachined nickel beams buckling under thermal loading will be presented in this paper. The focus will be on characterizing key design parameters important to the implementation of electroplated nickel beams as the actuation mechanism in a thermally adaptive microvalve. An analytical model of the thermal buckling phenomena has been developed and validated with test results from electroplated nickel beams with slight eccentricities. Highly nonlinear deflection versus temperature curves were predicted by the closed form model and match well with experimental measurements. Buckling deflections of more than 50μm were achieved at actuation temperatures under 100°C. The nickel beam fabrication process will be presented, as well as various fabrication related issues impacting the actuation capabilities of the beams.

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