The other side of UV:YAG laser in printed circuit board fabrication, some experiments and experiences, not always microvia related

2002 ◽  
Author(s):  
R. Kohler ◽  
J. Kaminski
Keyword(s):  
Printed Circuit Board ◽  
The Other ◽  
Circuit Board ◽  
Printed Circuit

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

1992 ◽  
Vol 114 (4) ◽  
pp. 425-435 ◽  
Author(s):  
S. Praharaj ◽  
S. Azarm
Keyword(s):  
Large Scale ◽  
Printed Circuit Board ◽  
Continuous Optimization ◽  
The Other ◽  
Circuit Board ◽  
Continuous Variables ◽  
Discrete Variables ◽  
Printed Circuit ◽  
Monotonicity Analysis ◽  
Optimization Based Design

In this paper, a new approach for optimization-based design of nonlinearly mixed discrete-continuous problems has been developed. The approach is based on a two-level decomposition strategy in which the entire domain of variables is partitioned into two levels, one involving the continuous variables and the other involving the discrete variables. Variables in one level are optimized for fixed values of the variable from the other level. A modified penalty function is formed, based on monotonicity analysis, to solve for the discrete variables, and a conventional optimization method is used to solve for the continuous variables. To improve the computational effectiveness of the approach, a constrained derivative relationship is also adopted. The performance of the entire algorithm is then demonstrated through an example involving a simplified model for printed circuit board assemblies. The objective in the example is to maximize assembly reliability by: (1) adding redundant components to the boards, and (2) optimally distributing allocated mass flow to the individual channels of the circuit boards. Number of variables in the example is then varied to investigate the effectiveness and potential of the approach for large-scale problems.

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

1992 ◽  
Author(s):  
S. Praharaj ◽  
Shapour Azarm
Keyword(s):  
Large Scale ◽  
Printed Circuit Board ◽  
Continuous Optimization ◽  
The Other ◽  
Circuit Board ◽  
Continuous Variables ◽  
Discrete Variables ◽  
Printed Circuit ◽  
Monotonicity Analysis ◽  
Optimization Based Design

Abstract In this paper, a new approach for optimization-based design of non-linearly mixed discrete-continuous problems has been developed. The approach is based on a two-level decomposition strategy in which the entire domain of variables is partitioned into two levels, one involving the continuous variables and the other involving the discrete variables. Variables in one level are optimized for fixed values of the variable from the other level. A modified penalty function is formed, based on monotonicity analysis, to solve for the discrete variables, and a conventional optimization method was used to solve for the continuous variables. To improve the computational effectiveness of the approach, a constrained derivative relationship was also adopted. The performance of the entire algorithm is then demonstrated through an example involving printed circuit board assemblies. The objective in the example is to maximize assembly reliability by: (1) adding redundant components to the boards and (2) optimally distributing allocated mass flow to the individual channels of the circuit boards. Number of variables in the example is then varied to investigate the effectiveness and potential of the approach for large-scale problems.

Shall Diensions or Low Dielectric Constant the Competing Approaches to High Density Interconnect

1987 ◽  
Vol 108 ◽  
Author(s):  
W. John Balde
Keyword(s):  
Printed Circuit Board ◽  
Major Change ◽  
The Other ◽  
Circuit Board ◽  
Low Dielectric Constant ◽  
Wire Length ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Path Lengths ◽  
Major Emphasis

EXTENDED ABSTRACTTen years ago, the conventional wisdom as cited by Rex Rice and others was that interconnect wiring on a silicon chip was much less expensive than interconnections on a ceramic hybrid, a printed circuit board, or cable interconnect. That led to a major emphasis on increasing the size and complexity of the silicon chip, with the other interconnect media left for the overflow or leftovers that could not be placed on the chip.A major change of thinking was triggered by Knausenberger and Schaper of AT&T (1), with the realization that costs normalized per inch of wire length were nearly identical for all forms of interconnect. Literally an inch of interconnection circuit costs the same whether that circuit was on silicon or on ceramic, whether that circuit was on a printed circuit board or in cable.If the only important criteria is the length of the interconnect, then a system or a board of the smallest size and area for a given circuit will have the shortest path lengths and the lowest cost. The dominant criteria is the area of the interconnection medium that carries the active silicon.

scholarly journals Design narrow-band frequency amplifier (1.5GHz -1.6GHz) based on InGaP Heterojunction Bipolar Transistor (HBT) and GaAs HBT

2021 ◽  
Vol 27 (2) ◽  
pp. 13-26
Author(s):  
ABDO Zouhair Ballouk ◽  
Fawaz Mofdi ◽  
Salem Ibrahim
Keyword(s):  
Input Signal ◽  
Printed Circuit Board ◽  
Narrow Band ◽  
Input Power ◽  
Bipolar Transistor ◽  
Heterojunction Bipolar Transistor ◽  
The Other ◽  
Circuit Board ◽  
Band Frequency ◽  
Printed Circuit

The research aims to design a narrow-band frequency drive amplifier (1.5GHz -1.6GHz), which is used to boost the transmitter amplifier's input signal or amplify the GPS, GlONASS signals at the L1 band. The Power Amplifier printed circuit board (PCB) prototype was designed using InGaP HBT homogeneous technology transistor and GaAs Heterojunction Bipolar Transistor (HBT) transistor. Two models have been compared; one of the models gave 16dB gain, and the other gave 23dB when using an input power signal (-15dBm). The PCB consumes 2.4W of power and has a physical dimension of 11 x 4 cm.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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