Effect of thermal residual stresses on the apparent interfacial fracture toughness of polymer/metal interface

2003 ◽  
Author(s):  
Qizhou Yao ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Residual Stresses ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Metal Interface ◽  
Thermal Residual Stresses ◽  
Polymer Metal

An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness

2005 ◽  
Author(s):  
Timothy P. Ferguson ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Fracture Mechanics ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Engineering Model ◽  
Metal Interface ◽  
Moisture Concentration ◽  
Interfacial Fracture Mechanics ◽  
Polymer Metal

Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.

Effect of Moisture on the Elastic Modulus and Interfacial Adhesion of Polymer-Metal Components in Microelectronic Assemblies

2003 ◽  
Author(s):  
Timothy P. Ferguson ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Elastic Modulus ◽  
Interfacial Adhesion ◽  
Interfacial Fracture ◽  
Moisture Diffusivity ◽  
Bending Test ◽  
Interfacial Fracture Toughness ◽  
Moisture Concentration ◽  
Polymer Metal ◽  
Effect Of Moisture

Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being one of the principal causes of many premature package failures. It is a multi-dimensional concern in electronic packaging, having an adverse effect on package reliability by changing both the mechanical properties and interfacial adhesion of the microelectronic assembly. In this paper, a study has been conducted to evaluate the moisture-induced degradation of both the elastic modulus of a commercially available no-flow underfill and the interfacial adhesion of the underfill to a copper alloy substrate. Three different levels of moisture preconditioning, 85C/50%RH, 85C/65%RH, and 85C/85RH%, were implemented in this study. Diffusion coefficient test specimens were constructed to experimentally measure the moisture diffusivity into the underfill resin and obtain the moisture saturation concentration for each level of moisture preconditioning. Flexural bend test specimens were made to characterize the effect of moisture on the elastic modulus of the underfill adhesive. Last, interfacial fracture toughness specimens with prefabricated interface cracks were used in a four point bending test to quantify the effect of moisture on interfacial fracture toughness. The results of this study will aid in the development of more robust microelectronic assemblies, demonstrating how both the elastic modulus and interfacial toughness change as a function of moisture concentration.

scholarly journals Evaluation of the Interfacial Fracture Toughness of Anodic Bonds

2007 ◽  
Vol 73 (735) ◽  
pp. 1266-1272 ◽  
Author(s):  
Yoshiaki NOMURA ◽  
Masaki NAGAI ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness
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