Fatigue investigation of lap shear solder joints using resistance spectroscopy

2002 ◽  
Author(s):  
C. Lizzul ◽  
J.H. Constable ◽  
G. Westby
Keyword(s):  
Solder Joints ◽  
Lap Shear

scholarly journals Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Metals ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 1295
Author(s):  
Sri Harini Rajendran ◽  
Seung Jun Hwang ◽  
Jae Pil Jung
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
Solder Joints ◽  
Solder Matrix ◽  
Fracture Analysis ◽  
Zro2 Nanoparticles ◽  
Solder Paste ◽  
Lap Shear ◽  
Matrix Fracture ◽  
The Matrix

This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.

Microstructural and Mechanical Characterization of Solder Joints Fabricated by Explosively Reacting Nanolayers

2008 ◽  
Author(s):  
Michael Tong ◽  
Jenn-Ming Yang
Keyword(s):  
Initial Temperature ◽  
Mechanical Characterization ◽  
Solder Joints ◽  
Initial Pressure ◽  
Processing Parameters ◽  
Joint Shear Strength ◽  
Lap Shear ◽  
Joint Shear ◽  
Solder Interface

The unique heat-releasing characteristics of explosively reactive nanolayers (RN) are used in this study to produce Si/solder/Si joints. The microstructure of the RN in the reacted state as well as the post-joining foil/solder interface is characterized via XRD, SEM, and TEM, which have never been done. Additionally, RN solder joints are mechanically characterized by single lap shear and nanoindentation to obtain a set of optimized processing parameters, specifically initial pressure applied (Pa) and initial temperature of the system (Ti). A maximum joint shear strength of ∼ 30MPa at Pa = 15MPa and Ti = 75°C. Furthermore, nanoindentation is used to clarify the mechanical behavior of individual layers and interfaces across the joints as a result of thermal aging.

Deformation analysis of lap-shear testing of solder joints

2005 ◽  
Vol 53 (9) ◽  
pp. 2633-2642 ◽  
Author(s):  
Y.-L. Shen ◽  
N. Chawla ◽  
E.S. Ege ◽  
X. Deng
Keyword(s):  
Solder Joints ◽  
Deformation Analysis ◽  
Shear Testing ◽  
Lap Shear

Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy

2008 ◽  
Author(s):  
Ken Holdermann ◽  
Gayatri Cuddalorepatta ◽  
Abhijit Dasgupta
Keyword(s):  
Grain Size ◽  
Focused Ion Beam ◽  
Solder Joints ◽  
Ion Beam ◽  
Fatigue Tests ◽  
Sac305 Solder ◽  
Creep Tests ◽  
Lap Shear ◽  
Mechanical Cycling ◽  
Sac Solder

This study examines microstructural recrystallization in Sn3.0Ag0.5Cu (SAC305) solder joints due to isothermal, mechanical cycling. It is well known that after reflow SAC solder joints at length scales of 200 μm consist of only a few grains [1–3]. This coarse microstructure makes the joint mechanically inhomogeneous and anisotropic, and non-repeatable. Creep tests conducted on modified lap-shear SAC305 solder joints therefore show significant scatter in their results, because of piece-to-piece variability in the microstructural morphology [1]. However, results of cyclic fatigue tests of the same SAC305 solder joints show less significant scatter [4]. One possible hypothesis is that dynamic recrystallization occurs during the cycling, resulting in a much finer (and hence more isotropic, homogeneous and repeatable) microstructure. Recrystallization of solder has been reported to occur under thermal cycling [5–6]. The objective of this study is to assess the extent of recrystallization of SAC305 solder during isothermal mechanical cycling fatigue. Focused ion beam technology is used to prepare a very clean and even surface to reveal the SAC305 grains in modified lap-shear test specimens, both before and after isothermal mechanical cycling. Polarized light microscopy, scanning electron microscopy and focused ion beam microscopy are used to reveal the microstructure of these SAC305 solder joints. The results show that mechanical cycling produces the same type of recrystallization behavior of SAC solder, as has been reported in the literature for thermally cycled specimens [5–6]. The number of grains in the SAC305 solder joint changes from a few to hundreds, during mechanical cycling. As expected, the recrystallization is observed to be localized around cracks in the solder joint, where the local stresses are the highest. The minimal grain size near the cracked region is approximately 4–6 μm and the average grain size increases significantly with increasing distance from the crack face. The transition of solder from very few (non-homogeneous and anisotropic) to a homogenous recrystallized state may be one possible explanation for differences in the extent of scatter in the data from creep tests and isothermal mechanical fatigue tests.

A design of a new miniature device for solder joints’ mechanical properties evaluation

2016 ◽  
Vol 231 (20) ◽  
pp. 3818-3830 ◽  
Author(s):  
Quang-Bang Tao ◽  
Lahouari Benabou ◽  
Laurent Vivet ◽  
Ky-Lim Tan ◽  
Jean-Michel Morelle ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Strain Rate ◽  
Solder Joints ◽  
Testing Machine ◽  
Testing Temperature ◽  
Material Behavior ◽  
Shear Strain Rate ◽  
Solder Alloys ◽  
Lap Shear

This paper makes a focus on the design of a micro-testing machine used for evaluating the mechanical properties of solder alloys. The different parts of the testing device have been developed and assembled in a manner that will facilitate the study of miniature solder joints as used in electronic packaging. A specific procedure for fabricating miniature lap-shear joint specimens is proposed in this work. The tests carried out with the newly developed machine serve to determine the material behavior of solder joints under different controlled loading and temperature conditions. Two new solder alloys, namely SACBiNi and Innolot, are characterized in the study, showing the influence of strain rate and temperature parameters on their respective mechanical responses. In addition, the as-cast and fracture surfaces of the solder joints are observed with a scanning electron microscope to reveal the degradation mechanisms. The SACBiNi solder alloy, which contains less Ni and Sb elements, is found to have smaller shear strength than the Innolot alloy, while its elongation to rupture is significantly improved at the same strain rate level and testing temperature. The highest shear strength is 58.9 MPa and 61.1 MPa under the shear strain rate of 2.0 × 10−2 s−1 and room temperature for the SACBiNi and Innolot solder joints, respectively. In contrast, the lowest shear strength values, 26.6 MPa and 29.5 MPa for SACBiNi and Innolot, respectively, were recorded for the strain rate value of 2.0 × 10−4 s−1 and at temperature of 125℃.

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Travis Dale ◽  
Yuvraj Singh ◽  
Ian Bernander ◽  
Ganesh Subbarayan ◽  
Carol Handwerker ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Axial Load ◽  
Solder Joints ◽  
Axial Loads ◽  
Cyclic Shear ◽  
Lap Shear ◽  
Shear Loads ◽  
Area Array ◽  
Compressive Loads ◽  
The Impact

Abstract Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear fatigue due to thermal expansion mismatch between the component and the substrate, larger area-array packages experience a combination of cyclic shear and axial tensile/compressive loads due to flexure of the substrate. Additionally, on larger processor packages, the attachment of heatsinks further exacerbates the imposed axial loads, as does package warpage. With the increase in size of packages due to 2.5D heterogeneous integration, the above additional axial loads can be significant. Thus, there exists a critical need to understand the impact on fatigue life of solder joints with superposed compressive/tensile loads on the cyclic shear loads. In this paper, we describe a carefully constructed multi-axial microprecision mechanical tester as well as fatigue test results on Sn3.0Ag0.5Cu (SAC305) solder joints subjected to controlled cyclic shear and constant compressive/tensile loads. The tester design allows one to apply cyclic shear loads up to 200 N while maintaining a constant axial load of up to 38 N in tension or compression. The tester is capable of maintaining the axial load to within a tolerance of ±0.5 N during the entirety of fatigue experiment. Carefully constructed test specimens of Sn3.0Ag0.5Cu solder joints were isothermally fatigued under systematically increased compressive and tensile loads imposed on the test specimen subject to repeated loading (R = 0) under lap-shear. In general, the imposition of the superposed compressive load increases the fatigue life of the solder joint compared to application of pure cyclic shear, while the imposition of the superposed tensile load decreases the fatigue life. At larger compressive loads, friction between fractured surfaces is responsible for significant energy dissipation during the cyclic load–unload cycles.

Strain Evolution during Lap Shear Testing of SnCu Solder

2011 ◽  
Vol 70 ◽  
pp. 303-308 ◽  
Author(s):  
Sankara J. Subramanian ◽  
Vijay K. R. Penmetcha
Keyword(s):  
Shear Strain ◽  
Solder Joints ◽  
Simple Calculation ◽  
Axial Displacement ◽  
Ease Of Use ◽  
Image Correlation ◽  
Transverse Displacement ◽  
Full Field ◽  
Lap Shear ◽  
Lap Shear Test

The lap-shear test is frequently used in the microelectronics industry to obtain mechanical properties of solder joints. In these tests, solder joints formed between slender metallic substrates are pulled apart in a simple shear configuration. Although it is known that calculation of stress-strain curves from lap shear tests is not straightforward due to rotation of the joints and strain inhomogeneity within the joint, these tests still find widespread use due to their simplicity and apparent ease of use. Chawla and co-workers [1, 2] show that the state of strain near the solder-substrate interfaces is significantly different from that in the interior of the joint and that this effect is only minimized for large joints. In the present work, we offer experimental evidence for these conclusions by presenting full-field strain measurements on solder joints in double-lap shear configuration, obtained using Digital Image Correlation (DIC). While confirming that significant strain gradients exist within the joint, the present work also indicates that a simple calculation of shear strain as axial displacement of the joint divided by joint thickness is misleading due to the presence of a significant gradient of the transverse displacement along the loading direction. This gradient persists through the course of the deformation and results in the actual average shear strain in the joint being smaller than that computed from the axial displacement alone.

Inhibiting the Re-Deposition of AuSn4 on Au/Ni Metallization Pads by Varying the Accessibility of Cu in Isothermally Aged SAC305 Solder Joints

2013 ◽  
Author(s):  
Subhasis Mukherjee ◽  
Abhijit Dasgupta ◽  
Julie Silk ◽  
Lay-ling Ong
Keyword(s):  
Solid State ◽  
Solder Joint ◽  
Barrier Layer ◽  
Solder Joints ◽  
Circuit Board ◽  
Nickel Layer ◽  
Gold Content ◽  
Sac305 Solder ◽  
Lap Shear ◽  
Sac Solder

Electroplated Ni/Au over Cu is a popular metallization for printed circuit board (PCB) finish as well as for component leads, especially for wire-bondable high frequency packages, where the gold thickness (≥ 20 μinches) requirement is high for wire bonding. Redeposition of bulk AuSn4 intermetallic compound (IMC) at Au/Ni contact pads of isothermally conditioned SnAgCu (SAC) solder joints is a critical reliability concern in these packages because the interfacial layer between redeposited AuSn4 IMC and initially formed IMC during reflow at the contact pad after reflow is brittle in nature. Redeposition of bulk AuSn4 IMC in Pb-free SAC solder joints (most popularly SAC305) is also believed to be dependent on the degree of access to copper. This study examines the effect of varying gold content (2–5 nominal weight-%) in the solder joint and accessibility to copper (by presence or absence of nickel barrier layer on top of Cu plating) on redeposition of AuSn4 IMCs at the interface of isothermally aged SAC305 solder joints for 720 hours at 121°C (0.8*Tmelt). The modified lap shear Iosipescu specimens used for the study are divided into two batches: i] In the first batch, both the copper platens to be soldered are electroplated with Au and Ni. Ni barrier layers are used to completely stop the solder from accessing the Cu in the substrate ii] In the second batch, one Cu platen is electroplated with Au and Ni barrier layer but the other platen is electroplated only with copper (no Nickel layer), to allow accessibility of Cu from the substrate. Representative solder joints from above two batches are then cross-sectioned and analyzed using environmental scanning electron microscopy (ESEM) and energy-dispersive x-ray spectroscopy (EDX) to investigate the composition, thickness and morphology of both bulk and interfacial IMCs. The first phase to form at the interface of the first batch of specimens after initial reflow is Ni3Sn4/(Ni,Cu)3Sn4. During the subsequent solid-state annealing, the redeposition of AuSn4 occurred in systems plated with Au/Ni on both sides. Contrarily, in the second batch when the solder joint has copper access from one side of the joint, the first intermetallic after reflow to form is (Cu,Ni,Au)6Sn5/(Cu,Au)6Sn5 and no redeposition of AuSn4 is observed after solid state annealing except for the solder joint containing nominal 5wt-% of Au.

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