Development of brazing interconnection to low thermal expansion glass-ceramics for high performance multichip packaging
2010 ◽
Vol 92
◽
pp. 65-71
◽
2018 ◽
Vol 84
(3)
◽
pp. 255-261
◽
Keyword(s):
1964 ◽
Vol 282
(1388)
◽
pp. 52-56
1988 ◽
Vol 3
(6)
◽
pp. 598-600
◽
Keyword(s):
1989 ◽
Vol 72
(6)
◽
pp. 1095-1095
Keyword(s):
Keyword(s):