Machine design optimization based on finite element analysis in a high-throughput computing environment

2012 ◽  
Author(s):  
Wenying Jiang ◽  
T.M. Jahns ◽  
T.A. Lipo ◽  
William Taylor ◽  
Yusaku Suzuki
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
High Throughput ◽  
Machine Design ◽  
Computing Environment ◽  
Element Analysis ◽  
High Throughput Computing

A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000094-000099 ◽  
Author(s):  
Laura Mirkarimi ◽  
Rajesh Katkar ◽  
Ron Zhang ◽  
Rey Co ◽  
Zhijun Zhao
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
High Yield ◽  
Element Analysis ◽  
Package Design ◽  
Simulation Methodology ◽  
Structural Modifications ◽  
Simulation Tools ◽  
Large Bandwidth

We are developing a new solution for wide I/O package on package applications, which is Bond Via Array (BVA) technology. The prototype vehicle built in this study has 1020 I/O's at a pitch of 0.24 mm with a high aspect ratio of approximately 10:1 and is ≤1.4 mm tall. PoP applications require large bandwidth and thinner packages challenging package developers to address warpage control for high yield processes. The design optimization of this package was established through rigorous finite element analysis of materials selection and structural modifications. The simulation methodology was validated by measuring the warpage as a function of temperature for the experimental prototypes. The details for the simulation and verification processes for the wide I/O process will be discussed. The variation between finite element analysis predictions and the experimental builds was ~10%, which allowed us to complete package design optimization with our simulation tools. The prototype build includes a standard and a low CTE substrate.

Design Optimization of the Aerial Lift Boom through the Finite-Element Analysis (FEA)

2011 ◽  
Vol 295-297 ◽  
pp. 1564-1567
Author(s):  
Yong Hong ◽  
Seokjun Yu ◽  
Jaejung Lee ◽  
Hyeonsu Ha ◽  
Dong Pyo Hong
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
Experimental Method ◽  
General Purpose ◽  
Element Analysis ◽  
Actual Experiment ◽  
Multi Stage ◽  
The Finite Element Analysis ◽  
Aerial Platform

The multi-stage boom consisting of several booms is used in order to develop the aerial platform truck that can be used in a working radius that is higher and safe. Because the length increases compared with the width or the height of the structure, the intensity and rigidity are lowered along with the safety. Accordingly, a countermeasure is needed. Therefore, in this research, when designing of the high ground work difference Boom System, the safety the stress of the considered boom the analyze method and experimental method tries to be evaluated through the comparison. The finite-element analysis(FEA) compared the Strain value which is obtained through the resolution value and actual experiment by using the Ansys,that is the general purpose program, and proved this safety.

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