On the modelling and placement of bonding-pillar holes in multi-wafer, vacuum-packaged MEMS

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ◽

10.1109/dtip.2018.8394181 ◽

2018 ◽

Cited By ~ 1

Author(s):

Alabi Bojesomo ◽

Wajih Syed ◽

Ibrahim M. Elfadel

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