A novel drie fabrication process development for SOI-based MEMS devices

2004 ◽  
Author(s):  
J. Li ◽  
Q.X. Zhang ◽  
A.Q. Liu
Keyword(s):  
Process Development ◽  
Fabrication Process ◽  
Mems Devices

Robust Mask-Layout and Process Synthesis Through an Evolutionary Algorithm

2000 ◽  
Author(s):  
Lin Ma ◽  
Erik K. Antonsson
Keyword(s):  
Synthesis Method ◽  
Fabrication Process ◽  
Process Synthesis ◽  
Automated Synthesis ◽  
Trial And Error ◽  
Mems Devices ◽  
Wide Range ◽  
Synthesis Tool ◽  
Fabrication Procedure ◽  
The Right

Abstract A method for automated mask-layout and process synthesis for MEMS is presented. The synthesis problem is approached by use of a genetic algorithm. For a given desired device shape, and several fabrication process choices, this synthesis method will produce one or more mask-layouts and associated fabrication process sequences (which when used can generate shapes close to the desired one). Given complicated device shapes and wide range of fabrication process possibilities, the designer may encounter difficulty producing the right mask-layout and fabrication procedure by experience and trial and error. An automated synthesis tool like this will be helpful to the designer by increasing the efficiency and accuracy of the design of MEMS devices.

SOI waveguide fabrication process development using star coupler scattering loss measurements

2007 ◽  
Author(s):  
K. P. Yap ◽  
J. Lapointe ◽  
B. Lamontagne ◽  
A. Delâge ◽  
A. Bogdanov ◽  
...  
Keyword(s):  
Process Development ◽  
Fabrication Process ◽  
Scattering Loss ◽  
Waveguide Fabrication

Fabrication process development for a high sensitive electrochemical IDA sensor

2012 ◽  
Vol 97 ◽  
pp. 235-240 ◽  
Author(s):  
S. Partel ◽  
M. Mayer ◽  
P. Hudek ◽  
C. Dinçer ◽  
J. Kieninger ◽  
...  
Keyword(s):  
Process Development ◽  
Fabrication Process

Fabrication process of a microstructures based on hydrogenated amorphous SiGe films for applications in MEMS devices

2015 ◽  
Vol 29 (4) ◽  
pp. 1673-1679 ◽  
Author(s):  
M. Galindo-Mentle ◽  
F. López-Huerta ◽  
R. Palomino-Merino ◽  
C. Zúñiga-Islas ◽  
W. Calleja-Arriaga ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Mems Devices ◽  
Hydrogenated Amorphous

Novel Fabrication Process for the Integration of MEMS Devices with Thick Amorphous Soft Magnetic Field Concentrators

2007 ◽  
Vol 1052 ◽  
Author(s):  
Simon Brugger ◽  
Wilhelm Pfleging ◽  
Oliver Paul
Keyword(s):  
Magnetic Field ◽  
Laser System ◽  
Magnetic Sensor ◽  
Fabrication Process ◽  
Magnetic Flux Density ◽  
Mems Devices ◽  
Integration Process ◽  
Soft Magnetic ◽  
Micro Patterning ◽  
Field Concentrator

AbstractThis paper reports a novel fabrication process enabling the integration of mechanical MEMS devices with thick amorphous soft magnetic field concentrators. The integration process combines silicon on insulator technology for the MEMS device fabrication and epoxy-resin-based attachment of 18-µm-thick amorphous soft magnetic ribbons followed by a wet chemical structuring process. The fabrication process is reported on the basis of a field-concentrator-based resonant magnetic sensor combining an electrostatically driven micromechanical resonator and a planar magnetic field concentrator with two narrow gaps. For realization of the concentrator gaps, the integration process is extended by micro-patterning of the soft magnetic ribbons via UV-laser ablation using an excimer laser system. The characterization of the fabricated resonant magnetic sensor using a stroboscopic video microscope for in-plane motion measurement shows a high sensitivity of 390 kHz/T at a magnetic flux density of 158 µT.

Computational Simulation on Thermal Aspect of Micro-Fabrication Process for MEMS Device

2005 ◽  
Author(s):  
Raymond K. Yee ◽  
Gabriel C. Chan
Keyword(s):  
Residual Stresses ◽  
Silicon Dioxide ◽  
Computational Simulation ◽  
Fabrication Process ◽  
Computational Method ◽  
Mems Devices ◽  
Micro Fabrication ◽  
Polysilicon Film ◽  
Mems Device ◽  
Micro Cantilever

The inherent residual stresses and strains from micro fabrication process can have profound effects on the functionality and reliability of MEMS devices. Surface micromachining fabrication involves a series of sequential steps of addition and subtraction of materials through deposition and etching techniques. For instance, when a typical micro cantilever beam is fabricated, layers of silicon dioxide and polysilicon structures are deposited on top of silicon substrate. Part of the silicon dioxide layer is chemically etched out before the deposition of polysilicon layer. Due to mismatch of coefficients of thermal expansion (CTE) in layered structure, thermal cycle loading during micromachining fabrication can induce significant residual stress within a part from thermal aspect alone. Computational method is used to simulate the micromachining fabrication process for MEMS and to predict the residual stresses/strains in a selected MEMS device. The focus of the study is on the thermal aspect of deposition and etching processes during micromachining. Particular attention is placed on the effects of deposition temperature and polysilicon film thickness on resulting residual stresses.

Cellulose Smart Material for Sensor, Actuator and MEMS Applications

2008 ◽  
Author(s):  
Jaehwan Kim ◽  
Sang Yeol Yang ◽  
Min Hee Lee ◽  
Jung Hwan Kim ◽  
Zhijiang Cai ◽  
...  
Keyword(s):  
Schottky Diode ◽  
Low Voltage ◽  
Cellulose Fibers ◽  
Smart Material ◽  
Device Fabrication ◽  
Fabrication Process ◽  
Mems Devices ◽  
Electromechanical Properties ◽  
Micro Patterning ◽  
Bending Actuator

Cellulose Electro-Active Paper (EAPap) has been discovered as a smart material that can be used as a sensor and actuator [1]. It has many advantages in terms of low voltage operation, light weight, low power consumption, low cost, biocompatibility and biodegradability. EAPap is made with cellulose paper coated with thin electrodes. EAPap shows a reversible and reproducible bending movement as well as longitudinal displacement under electric field. The out-of-plane bending deformation is useful for achieving flapping wings, micro-insect robots, and smart wall papers. On the other hand, in-plane strains, such as extension and contraction of EAPap materials are also promising for artificial muscle applications. The actuation principle of cellulose EAPap bending actuator is known to be a combination of piezoelectric effect and ion migration effect. This paper presents further investigation of cellulose EAPap for actuator, sensor and MEMS devices. Piezoelectricity is one of major actuating mechanism of cellulose EAPap. Cellulose is a complex anisotropic material. Aligning cellulose fibers in the fabrication process is a critical parameter to improve mechanical and electromechanical properties of EAPap such as stiffness, strength, piezoelectricity and so on. Cotton cellulose fibers are dissolved into a solution using NaOH/urea and DMAc/LiCl methods. In the later method, the dissolution and shaping of cellulose can be carried out by DMAc/LiCl. Cellulose pulp was mixed with lithium chloride (LiCl) and dehydrated by heating. After adding DMAc (N, N-dimethylacetamide) to the mixture, swell it in room temperature. By heating it a solution formation can be obtained. There are some issues on eliminating solvent and ions and regenerating a pure cellulose films. The material processing all about EAPap has been introduced [2, 3]. Wet drawn stretching method is used in the fabrication process of cellulose film to increase its mechanical and electromechanical properties. This wet-drawn cellulose EAPap is termed as Piezo-Paper. Cellulose EAPap material can be customized to satisfy the material requirement for specific applications. Piezo-Paper can be used for strain sensors, vibration sensors, ultrasonic transducers, SAW devices, speakers, microphones, stack actuators, bending actuators and MEMS devices. Figure 1 shows some applications. Piezoelectric charge constant of Piezo-Paper is 70 pC/N. Details of piezoelectric characteristics of Piezo-Paper and its applications are presented in this paper. Micro-fabrication on cellulose EAPap has many applications, for example, MEMS sensors, e-Paper, thin film transistor (TFT), and even microwave-driven EAPap actuator. To develop microwave-driven EAPap actuator, rectenna (rectifying antenna) has been developed [4]. Rectenna can rectify microwaves and feed dc power without wire. Thus, this technology has many applications. To fabricate the rectenna array on cellulose EAPap, micro patterning of metallic layer and Schottky diode fabrication were studied. The Schottky diode fabrication gives the possibility of TFT on cellulose sheet. Advancing from this technology, SAW (Surface Acoustic Wave) device fabrication for humidity sensor is possible. The devices fabrication along with the characterization and their demonstration will be shown. Cellulose EAPap technology will bring the dream of flying magic paper into real world in the near future.

Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective

2003 ◽  
Vol 125 (4) ◽  
pp. 816-823 ◽  
Author(s):  
Srinivas A. Tadigadapa ◽  
Nader Najafi
Keyword(s):  
Microelectromechanical Systems ◽  
Process Development ◽  
Reliability Testing ◽  
Mems Devices ◽  
Manufacturing Strategy ◽  
Cad Tools ◽  
Fragile State ◽  
Mems Packaging ◽  
Overall Performance

This paper presents a discussion of some of the major issues that need to be considered for the successful commercialization of MEMS products. The diversity of MEMS devices and historical reasons have led to scattered developments in the MEMS manufacturing infrastructure. A good manufacturing strategy must include the complete device plan including package as part of the design and process development of the device. In spite of rapid advances in the field of MEMS there are daunting challenges that lie in the areas of MEMS packaging, and reliability testing. CAD tools for MEMS are starting to get more mature but are still limited in their overall performance. MEMS manufacturing is currently at a fragile state of evolution. In spite of all the wonderful possibilities, very few MEMS devices have been commercialized. In our opinion, the magnitude of the difficulty of fabricating MEMS devices at the manufacturing level is highly underestimated by both the current and emerging MEMS communities. A synopsis of MEMS manufacturing issues is presented here.

Sign in / Sign up

Export Citation Format

Share Document