Towards a better understanding of failure modes and test requirements of ADCs

2002 ◽  
Author(s):  
A. Lechner ◽  
A. Richardson ◽  
B. Hermes
Keyword(s):  
Failure Modes ◽  
Test Requirements

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Karumbu Meyyappan ◽  
Milena Vujosevic ◽  
Qifeng Wu ◽  
Pramod Malatkar ◽  
Charles Hill ◽  
...  
Keyword(s):  
Failure Modes ◽  
Field Performance ◽  
Test Methods ◽  
Automotive Electronics ◽  
Automotive Market ◽  
Damage Models ◽  
Knowledge Based ◽  
Industry Standards ◽  
Solder Joint Fatigue ◽  
Test Requirements

This paper intends to address an important gap between reliability standards and the physics of how components respond to real use conditions using a knowledge-based qualification (KBQ) process. Bridging the gap is essential to developing test methods that better reflect field performance. With the growth in importance of automotive market and the wide usage of electronics in this market, vibration-induced failures was chosen for this study. MIL-STD-810G and ISTA4AB are couple of industry standards that address the risk of shipping finished goods to a customer. For automotive electronic products that are exposed to vibration conditions all through their life, USCAR-2 and GMW3172 are more relevant. Even though the usage models and transportation duration for shipping fully packaged systems is different from automotive electronics, the source of energy (road conditions), driving the risks, are similar. The industry standards-based damage models appear to be generic, covering a wide variety of products and failure modes. Whereas, the KBQ framework, used in this paper, maps use conditions to accelerated test requirements for only two failure modes: solder joint fatigue and socket contact fretting. The mechanisms were chosen to be distinct with different damage metric and drivers. The process is intended to explain how industry standards reflect field risks for two of the risks relevant for automotive electronics.

Critical Assessment of PVDF Multilayer Barriers in Unbonded Flexible Risers: Applications and Benefits

2013 ◽  
Author(s):  
Upul S. Fernando ◽  
Michelle Davidson ◽  
Terry Sheldrake
Keyword(s):  
Failure Modes ◽  
Single Layer ◽  
Design Strategies ◽  
Pipe Failure ◽  
Flexible Pipe ◽  
Essential Requirement ◽  
Flexible Risers ◽  
Service Application ◽  
Test Requirements ◽  
Hydrocarbon Media

The polymer barrier is the key component in a flexible pipe structure that is specifically designed to contain hydrocarbon media within the pipe. Maintaining the integrity of the barrier for the total service life of the pipe is therefore an essential requirement to prevent any leaking or spilling of the hydrocarbon into the external environment. For high temperature (> 100°C) service PVDF is commonly used as a barrier material, and the barrier designs are based on either single layer or multilayer (two or three layers) structures depending on design strategy, manufacturing constraints and service application. This paper presents a critical review of the barrier design strategies, considering both single and multilayer structures. The main parameters in deciding a reliable barrier structure are discussed and the advantages/disadvantages of multilayers over single layers are highlighted. The different pipe failure modes/mechanisms that may be related to different barrier structures, the analyses and test requirements to evaluate and overcome these failures are discussed.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Human reliability in non-destructive inspections of nuclear power plant components: modeling and analysis

2019 ◽  
Vol 7 (2B) ◽  
Author(s):  
Vanderley Vasconcelos ◽  
Wellington Antonio Soares ◽  
Raissa Oliveira Marques ◽  
Silvério Ferreira Silva Jr ◽  
Amanda Laureano Raso
Keyword(s):  
Power Plant ◽  
Nuclear Power Plant ◽  
Human Factors ◽  
Nuclear Power ◽  
Power Plants ◽  
Failure Modes ◽  
Cooling System ◽  
Human Reliability ◽  
Non Destructive ◽  
Plant Components

Non-destructive inspection (NDI) is one of the key elements in ensuring quality of engineering systems and their safe use. This inspection is a very complex task, during which the inspectors have to rely on their sensory, perceptual, cognitive, and motor skills. It requires high vigilance once it is often carried out on large components, over a long period of time, and in hostile environments and restriction of workplace. A successful NDI requires careful planning, choice of appropriate NDI methods and inspection procedures, as well as qualified and trained inspection personnel. A failure of NDI to detect critical defects in safety-related components of nuclear power plants, for instance, may lead to catastrophic consequences for workers, public and environment. Therefore, ensuring that NDI is reliable and capable of detecting all critical defects is of utmost importance. Despite increased use of automation in NDI, human inspectors, and thus human factors, still play an important role in NDI reliability. Human reliability is the probability of humans conducting specific tasks with satisfactory performance. Many techniques are suitable for modeling and analyzing human reliability in NDI of nuclear power plant components, such as FMEA (Failure Modes and Effects Analysis) and THERP (Technique for Human Error Rate Prediction). An example by using qualitative and quantitative assessesments with these two techniques to improve typical NDI of pipe segments of a core cooling system of a nuclear power plant, through acting on human factors issues, is presented.

Corrosion of Electronic and Magnetic Devices and Materials

1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel
Keyword(s):  
Thin Film ◽  
Failure Modes ◽  
Galvanic Corrosion ◽  
Potential Drop ◽  
Magnetic Devices ◽  
Disk Structure ◽  
Magnetic Layers ◽  
Ohmic Potential Drop ◽  
Corrosion Problem ◽  
Corrosion Susceptibility

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.

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