Non-destructive Quality Evaluation Technique for Processed Phyllanthus Emblica(Gooseberry) Using Image Processing

2013 ◽  
Author(s):  
R. K. Patel ◽  
K. R. Jain ◽  
T. R. Patel
Keyword(s):  
Image Processing ◽  
Quality Evaluation ◽  
Phyllanthus Emblica ◽  
Evaluation Technique ◽  
Non Destructive

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

Efficiency Improvement of Metal Lathing by Using of an Evaluation Technique of Assembly Machine Tools Quality

2016 ◽  
Vol 684 ◽  
pp. 421-428 ◽  
Author(s):  
D.S. Vasilega ◽  
M.S. Ostapenko
Keyword(s):  
Machine Tool ◽  
Machine Tools ◽  
Quality Evaluation ◽  
Composite Index ◽  
Production Operation ◽  
Evaluation Technique ◽  
Efficiency Improvement ◽  
Index Of Quality

They defined conditions of use, calculated a composite index of quality for different tools, chose a machine tool according to its quality evaluation, calculated efficiency of processing by tools with different parameters for a certain production operation.

Non-destructive quality evaluation of fruit by color based on RGB LEDs system

2014 ◽  
Author(s):  
Ommi Kalsom Mardziah Yahaya ◽  
Mohd Zubir MatJafri ◽  
Azlan Abdul Aziz ◽  
Ahmad Fairuz Omar
Keyword(s):  
Quality Evaluation ◽  
Non Destructive

scholarly journals Digital processing of leaf area of soybeans, subjected to different treatments of seeds

2020 ◽  
Vol 13 (3) ◽  
pp. 24
Author(s):  
M. L. V. Passos ◽  
J. B. C. Souza ◽  
E. A. Silva ◽  
C. A. A. C. Silva ◽  
W. S. Sousa ◽  
...  
Keyword(s):  
Image Processing ◽  
Computer Program ◽  
Leaf Area ◽  
Seed Treatment ◽  
Digital Camera ◽  
Digital Processing ◽  
Thiophanate Methyl ◽  
Beneficial Effects ◽  
Non Destructive

Digital image processing, when applied to the study of leaf area, allows the integration of the direct measurement and non-destructive, and thus preserves the integrity of the plant. The objective was the quantification of the leaf area of soybean, cv. FTS Paragominas RR, submitted to different treatments of seed with the use of the computer program ImageJ, and basic presuppositions of image processing. The experiment was conducted at the Center of Agrarian Sciences and Environmental, Federal University of Maranhão, in Chapadinha (MA), in the period from February to June 2018. The seeds of soybean 'Paragominas RR' were submitted to the technique of seed treatment, consisting of three fungicides of the active ingredients, thiophanate methyl + fluazinam, fludioxonil and carbendazim + tiram, an insecticide active ingredient fipronil and the control. The leaf area was analyzed in the growth phase, through the use of digital camera and ImageJ®. The use of the routines in the computer program ImageJ® were effective for the determination of leaf area of the soybean submitted to different treatments of the seed. The thiophanate methyl + fluazinam in the dose 200 mL per 100 kg of seeds showed beneficial effects on growth of the cv. FTS Paragominas RR, as estimated by the leaf area.

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