SAT: Switchable Address Translation for Flash Memory Storages

2010 ◽  
Author(s):  
Yeonseung Ryu
Keyword(s):  
Flash Memory ◽  
Address Translation

Novel Three Dimensional (3D) NAND Flash Memory Array Having Tied Bit-line and Ground Select Transistor (TiGer)

2012 ◽  
Vol E95.C (5) ◽  
pp. 837-841 ◽  
Author(s):  
Se Hwan PARK ◽  
Yoon KIM ◽  
Wandong KIM ◽  
Joo Yun SEO ◽  
Hyungjin KIM ◽  
...  
Keyword(s):  
Flash Memory ◽  
Three Dimensional ◽  
Nand Flash ◽  
Nand Flash Memory ◽  
Memory Array

Simulation of Retention Characteristics in Double-Gate Structure Multi-Bit SONOS Flash Memory

2009 ◽  
Vol E92-C (5) ◽  
pp. 659-663 ◽  
Author(s):  
Doo-Hyun KIM ◽  
Il Han PARK ◽  
Seongjae CHO ◽  
Jong Duk LEE ◽  
Hyungcheol SHIN ◽  
...  
Keyword(s):  
Flash Memory ◽  
Double Gate ◽  
Gate Structure ◽  
Retention Characteristics

Adaptive Interference Mitigation for Multilevel Flash Memory Devices

2011 ◽  
Vol E94-A (11) ◽  
pp. 2453-2457
Author(s):  
Myeongwoon JEON ◽  
Kyungchul KIM ◽  
Sungkyu CHUNG ◽  
Seungjae CHUNG ◽  
Beomju SHIN ◽  
...  
Keyword(s):  
Flash Memory ◽  
Interference Mitigation ◽  
Memory Devices

Analysis of Leakage Failures in Flash Memory Devices and Root Cause Identification

2000 ◽  
Author(s):  
J. N. C. de Luna ◽  
M. O. del Fierro ◽  
J. L. Muñoz
Keyword(s):  
Flash Memory ◽  
Electromagnetic Interference ◽  
Yield Loss ◽  
High Amplitude ◽  
Physical Analysis ◽  
Input Buffer ◽  
Automated Test Equipment ◽  
Root Cause ◽  
Root Cause Identification ◽  
Test Process

Abstract An advanced flash bootblock device was exceeding current leakage specifications on certain pins. Physical analysis showed pinholes on the gate oxide of the n-channel transistor at the input buffer circuit of the affected pins. The fallout contributed ~1% to factory yield loss and was suspected to be caused by electrostatic discharge or ESD somewhere in the assembly and test process. Root cause investigation narrowed down the source to a charged core picker inside the automated test equipment handlers. By using an electromagnetic interference (EMI) locator, we were able to observe in real-time the high amplitude electromagnetic pulse created by this ESD event. Installing air ionizers inside the testers solved the problem.

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