A concurrent commutation failure detection method for multi-infeed HVDC systems

2017 ◽  
Author(s):  
Xiyang Liu ◽  
Zengping Wang ◽  
Yujin Yang ◽  
Linze Li
Keyword(s):  
Detection Method ◽  
Failure Detection ◽  
Commutation Failure

Failure Detection Method for GaN-Based Dosimetric Systems

2015 ◽  
Vol 644 ◽  
pp. 78-82 ◽  
Author(s):  
Pierrick Guiral ◽  
Jean Marc Galvan ◽  
Patrick Pittet ◽  
Ruo Xi Wang ◽  
Guo Neng Lu ◽  
...  
Keyword(s):  
Spectral Analysis ◽  
Optical Fiber ◽  
Detection Method ◽  
Failure Detection ◽  
Normal Operation ◽  
Transmission Ratio ◽  
Fiber Probe ◽  
Optical Fiber Probe ◽  
Uv Excitation ◽  
Fiber Connection

We propose a failure detection method for GaN-based dosimetric systems, which basically consist of a GaN-incorporated optical fiber probe coupled to a photodetection module. The method consists in introducing UV excitation with a 285nm LED, and detecting the photoluminescence (PL) of the GaN transducer centered at 380nm. Spectral analysis of the detected signal allows verification of normal operation and identification of failure cases, due to problems of GaN-fiber coupling and poor fiber connection between probe and photodetection module. The proposed method is implemented and experimentally tested, including the use of a 660nm LED to illuminate the probe to verify the transmission ratio between probe and photodetection module. The validity of this method has been verified.

High-Frequency TSV Failure Detection Method with Z Parameter

2012 ◽  
Author(s):  
Joohee Kim ◽  
Daniel H. Jung ◽  
Jonghyun Cho ◽  
Jun So Pak ◽  
Joungho Kim ◽  
...  
Keyword(s):  
Frequency Domain ◽  
High Frequency ◽  
Detection Method ◽  
Failure Detection ◽  
Domain Analysis ◽  
Frequency Domain Analysis ◽  
Z Parameter ◽  
Die Stacking ◽  
Failure Types

Abstract As the TSV count increases, chip yield can be severely degraded due to failures during the TSV or die-stacking processes. This paper will present and discuss on the usage of failure masks designed to detect and differentiate failure types such as connection failure and insulator failure based on frequency-domain one point probing measurement. The failure masks are proposed on the basis of the frequency domain analysis of TSV failures with Z11 magnitudes.

Sign in / Sign up

Export Citation Format

Share Document