Energy efficient heat sink design: Natural vs. forced convection cooling

2016 ◽  
Author(s):  
D. Christen ◽  
M. Stojadinovic ◽  
J. Biela
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Energy Efficient ◽  
Convection Cooling ◽  
Heat Sink Design

Energy Efficient Heat Sink Design: Natural Versus Forced Convection Cooling

2017 ◽  
Vol 32 (11) ◽  
pp. 8693-8704 ◽  
Author(s):  
Daniel Christen ◽  
Milos Stojadinovic ◽  
Juergen Biela
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Energy Efficient ◽  
Convection Cooling ◽  
Heat Sink Design

A Novel Approach to Low Profile Heat Sink Design

2010 ◽  
Vol 132 (9) ◽  
Author(s):  
Jason Stafford ◽  
Ed Walsh ◽  
Vanessa Egan ◽  
Pat Walsh ◽  
Yuri S. Muzychka
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Theoretical Study ◽  
Convection Heat Transfer ◽  
Transfer Rates ◽  
Novel Approach ◽  
Low Profile ◽  
Small Footprint ◽  
Convection Cooling ◽  
Heat Sink Design

This paper discusses the importance of developing cooling solutions for low profile devices. This is addressed with an experimental and theoretical study on forced convection cooling solution designs that could be implemented into such devices. Conventional finned and corresponding finless designs of equal exterior dimensions are considered for three different heat sink profiles ranging from 1 mm to 4 mm in combination with a commercially available radial blower. The results show that forced convection heat transfer rates can be enhanced by up to 55% using finless designs at low profiles with relatively small footprint areas. Overall, this paper provides optimization and geometry selection criteria, which are relevant to designers of low profile cooling solutions.

scholarly journals A Numerical and Experimental Study of a Novel Heat Sink Design for Natural Convection Cooling of LED Grow Lights

Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4046
Author(s):  
Ram Adhikari ◽  
Dawood Beyragh ◽  
Majid Pahlevani ◽  
David Wood
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Large Scale ◽  
High Efficiency ◽  
Experimental Testing ◽  
Growth Stages ◽  
Air Cooling ◽  
Convection Cooling ◽  
Heat Sink Design

Light-emitting diode (LED) grow lights are increasingly used in large-scale indoor farming to provide controlled light intensity and spectrum to maximize photosynthesis at various growth stages of plants. As well as converting electricity into light, the LED chips generate heat, so the boards must be properly cooled to maintain the high efficiency and reliability of the LED chips. Currently, LED grow lights are cooled by forced convection air cooling, the fans of which are often the points of failure and also consumers of a significant amount of power. Natural convection cooling is promising as it does not require any moving parts, but one major design challenge is to improve its relatively low heat transfer rate. This paper presents a novel heat sink design for natural convection cooling of LED grow lights. The new design consists of a large rectangular fin array with openings in the base transverse to the fins to increase air flow, and hence the heat transfer. Numerical simulations and experimental testing of a prototype LED grow light with the new heat sink showed that openings achieved their intended purpose. It was found that the new heat sink can transfer the necessary heat flux within the safe operating temperature range of LED chips, which is adequate for cooling LED grow lights.

The Development of an Integrated Fan and Heat Sink Solution for Thermal Management in Low Profile Applications

2006 ◽  
Author(s):  
Ed Walsh ◽  
Ronan Grimes
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Sinks ◽  
Portable Electronics ◽  
Low Profile ◽  
Convection Cooling ◽  
New Methodologies ◽  
Heat Sink Design ◽  
Management Issues

The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of a low profile integrated fan and heat sink solution to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics. We investigate two heat sink designs with mini channel features, applicable to low profile applications. The thermal performance of the heat sinks is seen to differ by approximately 40% and highlights the importance of efficient heat sink design at this scale.

scholarly journals Research on Cooling Method in Surfacing Repair Process of Aero Compressor Blade

2020 ◽  
Vol 2020 ◽  
pp. 1-19
Author(s):  
Shijie Dai ◽  
Miao Gong ◽  
Liwen Wang ◽  
Tao Wang
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Molten Pool ◽  
Cooling Effect ◽  
Modeling And Simulations ◽  
Cooling Method ◽  
Jet Impact ◽  
Convection Cooling ◽  
Vertical Jet

For the cooling method in surfacing repairing, most of the research focuses on the method based on the fixture structure. However, due to the low thermal conductivity and ultrathin alloy blade, the heat transfer speed from the molten pool to fixture is slow. When the heat is transferred to the fixture, most of the molten pool has solidified and absorbed or segregated out some impurities. Therefore, how to cool the welding area directly is more critical. For this reason, the thermal cycle characteristics of typical points of the blade and the heat transfer process of the key area of the fixture are analyzed, the original cooling time is calculated, and two innovative cooling methods based on lateral forced convection cooling and vertical jet impact forced convection cooling are proposed. For lateral forced cooling, with “AF-field” lateral convection cooling modeling, the cooling effects of characteristic points and sections under different flow velocities are calculated. For vertical jet impact cooling, the pressure, flow rate, and convective heat flux distribution on the wall under different impact heights and nozzle diameter are calculated. The influence of different inlet flow rates on cooling performance is influenced, based on the analysis results of impact modeling, the moving heat sink model is established, and the cooling effect under different heat sink-source distances is calculated. The heat transfer rules of two methods are analyzed in detail through modeling and simulations. The results show that both methods can improve the cooling effect and the vertical jet impact cooling method has an effect that is more obvious. When the nozzle radius is 2 mm, the impact height is 4d, the inlet flow velocity is 35 m/s, and the distance is 7 mm, and the cooling time under the vertical jet impact method is shortened by 12.5%, which can achieve better cooling effect. The experiment further validates the effectiveness of the modeling and simulations.

scholarly journals Simulation of Temperature Distribution in Horizontal Fin Heat Sink CPU Processor Using Comsol Multiphysics and Proportional Control

2015 ◽  
Vol 1 (1) ◽  
pp. 1
Author(s):  
T.D. Sugiarto ◽  
R.F. Iskandar ◽  
Ismudiati Puri Handayani
Keyword(s):  
Temperature Distribution ◽  
Surface Area ◽  
Forced Convection ◽  
Heat Sink ◽  
Air Gap ◽  
Comsol Multiphysics ◽  
Convection Coefficient ◽  
Proportional Control ◽  
Fin Thickness ◽  
Heat Sink Design

This research is aimed to analyze and simulate the temperature distribution in heat sink CPU processor. The study analyzes the heat absorption from the heat source to the bottom of the heat sink, the conduction process, and the forced convection process. All processes are simulated with software Comsol Multiphysics 4.4 to obtain the optimal heat sink design. The simulation is performed by varying the number of fins, the fin thickness, the air gap between two fins, the fin surface area, and the convection coefficient. The optimal design is found for heat sink with 40 pieces fins, fin thickness of 0.4 mm, air gap of 2.4 mm, fin surface area of 9425 mm2, and the convection coefficient of 5.26 W/m2K. Further simulation shows that PID control improved the forced convection process. A proportional control (P) is reasonable enough to achieve a settled convection process. A settling temperature occurs at 241 s after heat is applied to the system. This is faster than non-controlled convection process which requires 1600 s instead. Additional integration and derivative controls will increase stability at later time.

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

2013 ◽  
Author(s):  
John Edward Fernandes ◽  
Saeed Ghalambor ◽  
Richard Eiland ◽  
Dereje Agonafer ◽  
Veerendra Mulay
Keyword(s):  
Power Consumption ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Reducing Power ◽  
Junction Temperature ◽  
System Level ◽  
Parasitic Load ◽  
Convection Cooling ◽  
Level Performance

The heat sink assembly of an air cooled CPU is modified to improve thermal performance of the module-level solution. This modification is employed in a dual-socket server that relies on system fans to move air for forced convection cooling of all heat generating components on the motherboard. Currently, in the data center industry, the focus is on reducing power consumption through application of energy-efficient cooling solutions. Fans installed in the server operate as a function of CPU die temperatures and represent a parasitic load that must be minimized. Improvement in system-level performance can be quantified in terms of reduced fan and server power consumption. The server is subjected to varying CPU utilizations and corresponding average fan speeds and power consumption are reported. Similarly, reduction in CPU junction temperature and server power at a given utilization can be computed by operating the fans at a constant speed. Difference in thermal performance and power consumption between the baseline and modified heat sink configurations was found to negligible when a TIM is applied. However, in the absence of a TIM, the modified assembly delivered as much as 24.4% reduction in CPU die temperature and 6.2% reduction in server power consumption. In addition, there is indiscernible variation in server power consumption between the baseline (with employment of TIM) and modified (with and without TIM application) heat sink assemblies. Thus, the modified configuration has possible applications in systems where a TIM may be undesirable or difficult to apply.

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