scholarly journals Accurate prediction of ferrite core loss with nonsinusoidal waveforms using only Steinmetz parameters

2003 ◽  
Author(s):  
K. Venkatachalam ◽  
C.R. Sullivan ◽  
T. Abdallah ◽  
H. Tacca
Keyword(s):  
Core Loss ◽  
Accurate Prediction ◽  
Ferrite Core

A New Technique for Measuring Ferrite Core Loss Under DC Bias Conditions

2008 ◽  
Vol 44 (11) ◽  
pp. 4127-4130 ◽  
Author(s):  
C.A. Baguley ◽  
U.K. Madawala ◽  
B. Carsten
Keyword(s):  
Core Loss ◽  
New Technique ◽  
Ferrite Core ◽  
Dc Bias ◽  
A New Technique

Estimation of Eddy-Current Loss for MnZn Ferrite Cores

2011 ◽  
Vol 382 ◽  
pp. 204-209 ◽  
Author(s):  
Hsiau Hsian Nien ◽  
Chuan Kuei Huang ◽  
Ming Yu Wang ◽  
Chih Wei Lin ◽  
Shih Kuen Changchien
Keyword(s):  
Eddy Current ◽  
Critical Role ◽  
Core Loss ◽  
Eddy Current Loss ◽  
Magnetic Flux Density ◽  
Magnetic Characteristics ◽  
Material System ◽  
Ferrite Core ◽  
Mnzn Ferrite ◽  
Current Loss

This paper proposes a new estimation for the eddy-current loss of MnZn ferrite cores. The eddy-current loss plays a critical role in the frequency range of 100-500 kHz, whereas the amount of the hysteresis loss dominates the core loss of magnetic devices below 100 kHz. However, the definition and calculation of eddy-current loss are not as easy or accurate. In the proposed estimation, the equivalent electrical circuit method is conducted for determining the grain conductivity and the driving current to replace the induced magnetic flux density in order to simplify measurement. The related electrical and magnetic characteristics are measured by an HP-4294 impedance analyzer. Finally, an EI30 (PC40 material system from TDK) MnZn ferrite core is used as an example to prove that this model can effectively estimate the eddy-current loss of MnZn ferrite cores at different frequencies and driving currents

scholarly journals Optimal Design and Analysis of the Stepped Core for Wireless Power Transfer Systems

2016 ◽  
Vol 2016 ◽  
pp. 1-8 ◽  
Author(s):  
Xiu Zhang ◽  
Xin Zhang
Keyword(s):  
Core Loss ◽  
Wireless Power Transfer ◽  
Magnetic Flux Density ◽  
Transfer System ◽  
Power Transfer ◽  
Wireless Power ◽  
Ferrite Core ◽  
Implantable Medical Devices ◽  
Wireless Power Transfer System

The key of wireless power transfer technology rests on finding the most suitable means to improve the efficiency of the system. The wireless power transfer system applied in implantable medical devices can reduce the patients’ physical and economic burden because it will achieve charging in vitro. For a deep brain stimulator, in this paper, the transmitter coil is designed and optimized. According to the previous research results, the coils with ferrite core can improve the performance of the wireless power transfer system. Compared with the normal ferrite core, the stepped core can produce more uniform magnetic flux density. In this paper, the finite element method (FEM) is used to analyze the system. The simulation results indicate that the core loss generated in the optimal stepped ferrite core can reduce about 10% compared with the normal ferrite core, and the efficiency of the wireless power transfer system can be increased significantly.

scholarly journals Calculation Methodologies of Complex Permeability for Various Magnetic Materials

Electronics ◽  
2021 ◽  
Vol 10 (17) ◽  
pp. 2167
Author(s):  
Eun S. Lee ◽  
Byeong Guk Choi
Keyword(s):  
Magnetic Materials ◽  
High Frequency ◽  
Core Loss ◽  
Operating Frequency ◽  
Complex Permeability ◽  
Magnetic Characteristics ◽  
Ferrite Core ◽  
Function Generator ◽  
The Real ◽  
The Core

In order to design power converters and wireless power systems using high-frequency magnetic materials, the magnetic characteristics for the inductors and transformers should be specified in detail w.r.t. the operating frequency. For investigating the complex permeability of the magnetic materials by simply test prototypes, the inductor model-based calculation methodologies for the complex permeability are suggested to find the core loss characteristics in this paper. Based on the measured results of the test voltage Ve, current Ie, and phase difference θe, which can be obtained simply by an oscilloscope and a function generator, the real and imaginary permeability can be calculated w.r.t. operating frequency by the suggested calculation methodologies. Such information for the real and imaginary permeability is important to determine the size of the magnetic components and to analyze the core loss. To identify the superiority of the high-frequency magnetic materials, three prototypes for a ferrite core, amorphous core, and nanocrystalline core have been built and verified by experiment. As a result, the ferrite core is superior to the other cores for core loss, and the nanocrystalline core is recommended for compact transformer applications. The proposed calculation for the complex (i.e., real and imaginary) permeability, which has not been revealed in the datasheets, provides a way to easily determine the parameters useful for industrial electronics engineers.

Ferrites in Transfer Molded Power SiPs – Challenges in Packaging

2019 ◽  
Vol 2019 (1) ◽  
pp. 000019-000026
Author(s):  
Tina Thomas ◽  
Marius van Dijk ◽  
Marc Dreissigacker ◽  
Stefan Hoffmann ◽  
Hans Walter ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Mechanical Stability ◽  
Mechanical Load ◽  
Core Loss ◽  
Circuit Board ◽  
Ferrite Core ◽  
Molding Process ◽  
Molding Compound ◽  
Power Semiconductors ◽  
Transfer Molding

Abstract Transfer-Molding-Process is enjoying growing interest when aiming for novel high-power density System-in-Packages (Power SiPs), where not only transistors and diodes, but also drivers, passives, coils and transformers are supposed to be integrated in one package. Encapsulating modules in a Transfer-Molding-Process induces higher mechanical load onto module components compared to conventional silicone potting. Previous investigations have shown, that integration of delicate components as ferrite cores into molded packages is not as trivial as integration of conventional Surface Mount Devices (SMDs) or power semiconductors; the brittle ferrites tend to fracture during the encapsulation process, resulting in higher ferrite core loss. The present study aims to identify main root causes for ferrite core cracking during manufacturing of molded Power SiPs. The test vehicle is a symmetrical Printed Circuit Board (PCB) based package with three pairs of E-shaped ferrite cores. The Epoxy Molding Compound (EMC) deployed here is characterized to enable filling simulations. Since technical datasheets of ferrites typically lack specifications of mechanical properties, ferrite materials are analyzed in more detail. Filling simulations and thermo-mechanical simulations are performed in order to gain insight into process-induced stress, which may induce cracks in the ferrites. In addition, different ferrite designs are evaluated regarding core losses and mechanical stability, and thus their tendency to fracture.

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