Optimal Job Releasing and Sequencing for a Reentrant Manufacturing Line with Finite Capacity Buffers

2006 ◽  
Author(s):  
Jose A. Ramirez-Hernandez ◽  
Emmanuel Fernandez
Keyword(s):  
Finite Capacity ◽  
Manufacturing Line ◽  
Reentrant Manufacturing

Transient State Analysis of Queue-Size Behavior and Throughput of the Manufacturing Line with Finite Buffer Capacity and Machine Setup and Closedown Times

2015 ◽  
Vol 809-810 ◽  
pp. 1438-1443
Author(s):  
Iwona Paprocka ◽  
Wojciech M. Kempa ◽  
Damian Krenczyk
Keyword(s):  
Production System ◽  
Buffer Capacity ◽  
Transient State ◽  
Setup Time ◽  
Idle Time ◽  
Finite Buffer ◽  
Production Task ◽  
Finite Capacity ◽  
Manufacturing Line ◽  
Waiting Line

A single machine queuing system with setup/closedown times generally distributed is considered. Production tasks enter the production system with exponentially distributed interarrival times and are served by times assumed to be generally distributed. Arriving production tasks form a single waiting line and are served in the order of their arrivals. A production task is stored in a finite-capacity buffer if it arrives and the machine is busy or setup activities are done. Whenever a production system is empty, the machine is stopped by a closedown time. The machine needs a setup time before providing the service of the first task after the idle time.

Stochastic control over finite capacity channels: Causality and feedback

2009 ◽  
Author(s):  
Charalambos D. Charalambous ◽  
Christos K. Kourtellaris ◽  
Photios Stavrou
Keyword(s):  
Stochastic Control ◽  
Finite Capacity

Finite Capacity Queue with Postponed Customers

2018 ◽  
Vol 9 (11) ◽  
pp. 1671-1680
Author(s):  
Rinsy Thomas ◽  
Susha D.
Keyword(s):  
Finite Capacity ◽  
Finite Capacity Queue

A New Method of Wafer Level Plan View TEM Sample Preparation by DualBeam

2008 ◽  
Author(s):  
Hyoung H. Kang ◽  
Michael A. Gribelyuk ◽  
Oliver D. Patterson ◽  
Steven B. Herschbein ◽  
Corey Senowitz
Keyword(s):  
Sample Preparation ◽  
Ex Situ ◽  
Wafer Level ◽  
Cross Sectional ◽  
Plan View ◽  
Manufacturing Line ◽  
Transmission Electron ◽  
Thin Lamella ◽  
Preparation Techniques

Abstract Cross-sectional style transmission electron microscopy (TEM) sample preparation techniques by DualBeam (SEM/FIB) systems are widely used in both laboratory and manufacturing lines with either in-situ or ex-situ lift out methods. By contrast, however, the plan view TEM sample has only been prepared in the laboratory environment, and only after breaking the wafer. This paper introduces a novel methodology for in-line, plan view TEM sample preparation at the 300mm wafer level that does not require breaking the wafer. It also presents the benefit of the technique on electrically short defects. The methodology of thin lamella TEM sample preparation for plan view work in two different tool configurations is also presented. The detailed procedure of thin lamella sample preparation is also described. In-line, full wafer plan view (S)TEM provides a quick turn around solution for defect analysis in the manufacturing line.

In FAB 300mm Wafer Level Atomic Force Probe Characterization

2012 ◽  
Author(s):  
Terence Kane
Keyword(s):  
Electrical Characterization ◽  
Dark Field ◽  
Wafer Level ◽  
Electrical Measurements ◽  
Manufacturing Line ◽  
Atomic Force ◽  
Monitoring Tools ◽  
Voltage Contrast ◽  
The Cost ◽  
Non Destructive

Abstract A 300mm wafer atomic force prober (AFP) has been installed into IBM’s manufacturing line to enable rapid, nondestructive electrical identification of defects. Prior to this tool many of these defects could not detected until weeks or months later. Moving failure analysis to the FAB provides a means of complementing existing FAB inspection and defect review tools as well as providing independent, non-destructive electrical measurements at an early point in the manufacturing cycle [1] Once the wafer sites are non destructively AFP characterized, the wafer is returned to its front opening unified pod (FOUP) carrier and may be reintroduced into the manufacturing line without disruption for further inspection or processing. Whole wafer atomic force probe electrical characterization has been applied to 32nm, 28nm, 20nm and 14nm node technologies. In this paper we explore the cost benefits of performing non-destructive AFP measurements on whole wafers. We have found the methodology of employing a whole wafer AFP tool complements existing in-line manufacturing monitoring tools such as brightfield/dark field optical inspection, SEM in-line inspection and in-line E-beam voltage contrast inspection (EBI).

scholarly journals The Influence of Equipment Design and Process Parameters on Granule Breakage in a Semi-Continuous Fluid Bed Dryer after Continuous Twin-Screw Wet Granulation

Pharmaceutics ◽  
2021 ◽  
Vol 13 (2) ◽  
pp. 293
Author(s):  
Alexander Ryckaert ◽  
Michael Ghijs ◽  
Christoph Portier ◽  
Dejan Djuric ◽  
Adrian Funke ◽  
...  
Keyword(s):  
Process Development ◽  
Wet Granulation ◽  
Major Goal ◽  
Drying Time ◽  
Process Step ◽  
Manufacturing Line ◽  
Fluid Bed ◽  
Twin Screw ◽  
Filling Phase ◽  
Twin Screw Granulation

The drying unit of a continuous from-powder-to-tablet manufacturing line based on twin-screw granulation (TSG) is a crucial intermediate process step to achieve the desired tablet quality. Understanding the size reduction of pharmaceutical granules before, during, and after the fluid bed drying process is, however, still lacking. A first major goal was to investigate the breakage and attrition phenomena during transport of wet and dry granules, the filling phase, and drying phase on a ConsiGma-25 system (C25). Pneumatic transport of the wet granules after TSG towards the dryer induced extensive breakage, whereas the turbulent filling and drying phase of the drying cells caused rather moderate breakage and attrition. Subsequently, the dry transfer line was responsible for additional extensive breakage and attrition. The second major goal was to compare the influence of drying air temperature and drying time on granule size and moisture content for granules processed with a commercial-scale ConsiGma-25 system and with the R&D-scale ConsiGma-1 (C1) system. Generally, the granule quality obtained after drying with C1 was not predictive for the C25, making it challenging during process development with the C1 to obtain representative granules for the C25.

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