Transient thermal analysis of fast switching devices by partially coupled FEM method

2006 ◽  
Author(s):  
Ahmed Lakhsasi ◽  
Youssef Hamri
Keyword(s):  
Thermal Analysis ◽  
Transient Thermal Analysis ◽  
Fast Switching ◽  
Fem Method ◽  
Transient Thermal ◽  
Switching Devices

Transient Thermal Analysis of a Space Reactor Power System

1993 ◽  
Vol 103 (1) ◽  
pp. 19-33
Author(s):  
Michael J. Gaeta ◽  
Frederick R. Best
Keyword(s):  
Thermal Analysis ◽  
Power System ◽  
Reactor Power ◽  
Transient Thermal Analysis ◽  
Space Reactor ◽  
Transient Thermal

Identification of thermo-mechanical fatigue fracture location by transient thermal analysis for high-temperature operating SiC power module assembled with ZnAl eutectic solder

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000028-000031 ◽  
Author(s):  
Fumiki Kato ◽  
Hiroki Takahashi ◽  
Hidekazu Tanisawa ◽  
Kenichi Koui ◽  
Shinji Sato ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Thermal Resistance ◽  
Thermal Cycle ◽  
Base Plate ◽  
Test Machine ◽  
Power Module ◽  
Eutectic Solder ◽  
Transient Thermal Analysis ◽  
The Individual ◽  
Transient Thermal

Abstract In this paper, we demonstrate that the structural degradation of a silicon carbide (SiC) power module corresponding to thermal cycles can be detected and tracked non-destructively by transient thermal analysis method. The purpose of this evaluation is to analyze the distribution of the thermal resistance in the power module and to identify the structure deterioration part. The power module with SiC-MOSFET were assembled using ZnAl eutectic solder as device under test. The individual thermal resistance of each part such as the SiC-die, the die-attachment, the AMCs, and the baseplate was successfully evaluated by analyzing the structure function graph. A series of thermal cycle test between −40 and 250°C was conducted, and the power modules were evaluated their thermal resistance taken out from thermal cycle test machine at 100, 200, 500 and 1000 cycles. We confirmed the increase in thermal resistance between AMCs and base plate in each thermal cycle. The portion where the thermal resistance increased is in good agreement with the location of the structural defect observed by scanning acoustic tomography (SAT) observation.

scholarly journals Transient Thermal Analysis of Welding Fixtures Design

2018 ◽  
Vol 195 ◽  
pp. 012042
Author(s):  
M T Anual ◽  
T R Sahroni ◽  
S Akmal ◽  
F A Nasution
Keyword(s):  
Thermal Analysis ◽  
Transient Thermal Analysis ◽  
Transient Thermal
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