Crosstalk noise and delay analysis for high speed on-chip global RLC VLSI interconnects with mutual inductance using 90nm process technology
Keyword(s):
2019 ◽
Vol 8
(2)
◽
pp. 101-106
Keyword(s):
2019 ◽
Vol 8
(9)
◽
pp. 3090-3093
Keyword(s):
2016 ◽
Vol 34
(15)
◽
pp. 3550-3562
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