scholarly journals A Cost and Performance Analytical Model for Large-Scale On-Chip Interconnection Networks

Author(s):  
Takanori Kurihara ◽  
Yamin Li
2008 ◽  
Vol 57 (9) ◽  
pp. 1169-1181 ◽  
Author(s):  
Avinash Karanth Kodi ◽  
Ashwini Sarathy ◽  
Ahmed Louri

Author(s):  
C. Stanis ◽  
D. Smith ◽  
P. Blauner ◽  
M. Small

Very Large Scale Integration necessitated an ongoing and rapid decrease in the minimum feature size which must be made on silicon devices with the aims of improving productivity and performance. Conductor lines are commonly made from Al(Cu). Widths of 1.5 μm for conductor lines are common today, submicron lines are in late stages of development and 0.25 μm lines will be needed. These dimensions present new issues since the feature size is of the same order as the grain size of the Al and other metal alloys presently used for chip wiring. In order to make on-chip wiring reliable at these dimensions it is necessary to optimise the resistance to the stresses placed on them: electromigration due to increasing current densities; thermal stresses due to differences in thermal expansivities. The kinetics of both processes are dominated by interface transport. The resistance of the metal to both stresses can be modified by alloying.


2012 ◽  
Vol 2012 ◽  
pp. 1-15 ◽  
Author(s):  
Andrew G. Schmidt ◽  
William V. Kritikos ◽  
Shanyuan Gao ◽  
Ron Sass

As the number of cores per discrete integrated circuit (IC) device grows, the importance of the network on chip (NoC) increases. However, the body of research in this area has focused on discrete IC devices alone which may or may not serve the high-performance computing community which needs to assemble many of these devices into very large scale, parallel computing machines. This paper describes an integrated on-chip/off-chip network that has been implemented on an all-FPGA computing cluster. The system supports MPI-style point-to-point messages, collectives, and other novel communication. Results include the resource utilization and performance (in latency and bandwidth).


Author(s):  
A. Ferrerón Labari ◽  
D. Suárez Gracia ◽  
V. Viñals Yúfera

In the last years, embedded systems have evolved so that they offer capabilities we could only find before in high performance systems. Portable devices already have multiprocessors on-chip (such as PowerPC 476FP or ARM Cortex A9 MP), usually multi-threaded, and a powerful multi-level cache memory hierarchy on-chip. As most of these systems are battery-powered, the power consumption becomes a critical issue. Achieving high performance and low power consumption is a high complexity challenge where some proposals have been already made. Suarez et al. proposed a new cache hierarchy on-chip, the LP-NUCA (Low Power NUCA), which is able to reduce the access latency taking advantage of NUCA (Non-Uniform Cache Architectures) properties. The key points are decoupling the functionality, and utilizing three specialized networks on-chip. This structure has been proved to be efficient for data hierarchies, achieving a good performance and reducing the energy consumption. On the other hand, instruction caches have different requirements and characteristics than data caches, contradicting the low-power embedded systems requirements, especially in SMT (simultaneous multi-threading) environments. We want to study the benefits of utilizing small tiled caches for the instruction hierarchy, so we propose a new design, ID-LP-NUCAs. Thus, we need to re-evaluate completely our previous design in terms of structure design, interconnection networks (including topologies, flow control and routing), content management (with special interest in hardware/software content allocation policies), and structure sharing. In CMP environments (chip multiprocessors) with parallel workloads, coherence plays an important role, and must be taken into consideration.


Sign in / Sign up

Export Citation Format

Share Document