"Extreme edge engineering" - 2 mm edge exclusion challenges and cost-effective solutions for yield enhancement in high volume manufacturing for 200 and 300 mm wafer fabs

2004 ◽  
Author(s):  
T. Tran ◽  
W. Roberts ◽  
J. Tiffany ◽  
I. Jekauc ◽  
N. Clements ◽  
...  
Keyword(s):  
Cost Effective ◽  
High Volume ◽  
Yield Enhancement ◽  
Extreme Edge ◽  
Edge Exclusion

Infrared Emission Spectroscopy as a Reliability Tool

1999 ◽  
Author(s):  
Q. Kim ◽  
S. Kayali
Keyword(s):  
Spatial Resolution ◽  
Emission Spectroscopy ◽  
Hot Spot ◽  
Cost Effective ◽  
Infrared Emission ◽  
Test System ◽  
Operating Conditions ◽  
Yield Enhancement ◽  
Infrared Emission Spectroscopy ◽  
Channel Temperature

Abstract In this paper, we report on a non-destructive technique, based on IR emission spectroscopy, for measuring the temperature of a hot spot in the gate channel of a GaAs metal/semiconductor field effect transistor (MESFET). A submicron-size He-Ne laser provides the local excitation of the gate channel and the emitted photons are collected by a spectrophotometer. Given the state of our experimental test system, we estimate a spectral resolution of approximately 0.1 Angstroms and a spatial resolution of approximately 0.9 μm, which is up to 100 times finer spatial resolution than can be obtained using the best available passive IR systems. The temperature resolution (<0.02 K/μm in our case) is dependent upon the spectrometer used and can be further improved. This novel technique can be used to estimate device lifetimes for critical applications and measure the channel temperature of devices under actual operating conditions. Another potential use is cost-effective prescreening for determining the 'hot spot' channel temperature of devices under normal operating conditions, which can further improve device design, yield enhancement, and reliable operation. Results are shown for both a powered and unpowered MESFET, demonstrating the strength of our infrared emission spectroscopy technique as a reliability tool.

Cost-effective, high-volume molecular beam epitaxy using a multi 6-in wafer reactor

2001 ◽  
Vol 227-228 ◽  
pp. 143-149
Author(s):  
Larry Leung ◽  
Damian Davison ◽  
Arthur Cornfeld ◽  
Frederick Towner ◽  
Dave Hartzell
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Cost Effective ◽  
High Volume

Integration of Electrografted Layers for the Metallization of Deep TSVs

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000803-000830
Author(s):  
Claudio Truzzi ◽  
F. Raynal ◽  
V. Mevellec ◽  
N. Frederich ◽  
D. Suhr ◽  
...  
Keyword(s):  
Cost Effective ◽  
High Volume ◽  
Molecular Engineering ◽  
Test Method ◽  
Film Properties ◽  
Wet Process ◽  
Integration Schemes ◽  
Chemical Grafting ◽  
3D Packaging ◽  
Conductive Surfaces

Electrografting (eG) is a molecular engineering technology delivering high-quality films for Through Silicon Vias (TSVs). It generates surface-initiated conformal films which are thin, continuous, adherent and uniform. It is a wet-process technique, operated in standard plating tools, and is used on (semi)-conductive surfaces. Chemical grafting (cG) is a similar technology, used to graft films on non-conductive surfaces. A wet deposition of insulator, barrier and copper seed layers inside deep TSVs using a combination of electrografting and chemical grafting techniques has already been demonstrated [1, 2]. Electrografting and chemical grafting formulations and processes have been developed and specifically tailored for TSV diameters ranging from 1 to 200 μm, covering a depth/diameter Aspect Ratio (AR) range from 2:1 to 20:1. Film thickness can be controlled to any value from 50nm to few microns, depending on the layer, with 5% 3ó in-wafer non-uniformity, providing a step coverage (bottom/top thickness ratio) value of up to 90%. Adhesion of all layers is measured using a 16-square scribe tape test method: all layers successfully pass the test. The presentation will focus on film properties and show how TSV formed using these layers meet all key process requirements such as conformality, uniformity, adhesion, reliability and industrial compatibility for cost-effective high volume manufacturing of TSV wafers. A comprehensive set of film properties and reliability data characterized on blanket and pattern 200-mm Si wafers will be discussed. Integration schemes of electrografted layers within current 3D packaging process flows will be presented.

Development of Substrates for Through Glass Vias

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000832-000845 ◽  
Author(s):  
Aric Shorey ◽  
Scott Pollard
Keyword(s):  
Material Properties ◽  
Glass Composition ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Volume ◽  
Chemical Durability ◽  
Thin Glass ◽  
Wide Range ◽  
Challenges And Opportunities ◽  
Substantial Progress

Through-substrate vias are critical for 3DS-IC integration. The choice of glass as an interposer substrate, TGV, present some interesting challenges and opportunities, making glass a compelling alternative to silicon. There are two primary challenges to begin building a precision interposer in thin glass. The first is high quality thin glass wafers (300 mm OD, thickness 0.05 to 0.10 mm, warp and TTV of 30 μm and 1 μm respectively). The second challenge is developing a process capable of providing small (5–10 μm) precision vias in a cost-effective way. “Glass” represents a large class of materials with a wide range of material properties. The first step in developing TGV is to identify the most appropriate glass composition for the application, which furthermore defines important properties such as coefficient of thermal expansion (CTE) and other mechanical properties, chemical durability and electrical properties. The manufacturing process used to develop the glass has a significant impact on quality and manufacturability. Fusion formed glass provides a solution for high volume manufacturing supply in an as-formed, ultra-thin, pristine glass manufactured to tight tolerances, and avoids the issues associated with polishing or thinning. The supply of 50 μm to 100 μm as-formed ultra-thin glass wafers can compare very favorably in cost relative to polished or thinned glass as well as thinned silicon wafer. While there are many technologies that have demonstrated vias in glass, challenges relating to via size and pitch, wafer strength and reliability remain to be resolved. However, substantial progress has been made to meet these challenges. Specific characterization data from some of these processes to demonstrate vias on the order of 10 μm diameter with a 100 μm glass thickness in alternative glass materials will be presented.

scholarly journals Laparoscopic partial hepatectomy is associated with improved postoperative clinical outcomes and is cost-effective when performed in high volume centers

HPB ◽  
2019 ◽  
Vol 21 ◽  
pp. S30-S31
Author(s):  
E. Eguia ◽  
P.J. Sweigert ◽  
P.C. Kuo ◽  
H. Janjua ◽  
M.H. Nelson ◽  
...  
Keyword(s):  
Clinical Outcomes ◽  
Partial Hepatectomy ◽  
Cost Effective ◽  
High Volume

Joining Dissimilar Materials Using Friction Stir Scribe Technique

2016 ◽  
Vol 139 (3) ◽  
Author(s):  
Piyush Upadhyay ◽  
Yuri Hovanski ◽  
Saumyadeep Jana ◽  
Leonard S. Fifield
Keyword(s):  
Low Cost ◽  
Dissimilar Materials ◽  
Cost Effective ◽  
High Volume ◽  
Industrial Applications ◽  
Critical Pathway ◽  
Friction Stir ◽  
Design Engineers ◽  
Cost Effective Method ◽  
Polymer Metal

Development of a robust and cost-effective method of joining dissimilar materials could provide a critical pathway to enable widespread use of multimaterial designs and components in mainstream industrial applications. The use of multimaterial components such as steel-aluminum and aluminum-polymer would allow design engineers to optimize material utilization based on service requirements and could often lead to weight and cost reductions. However, producing an effective joint between materials with vastly different thermal, microstructural, and deformation responses is highly problematic using conventional joining and/or fastening methods. This is especially challenging in cost sensitive, high volume markets that largely rely on low cost joining solutions. Friction stir scribe (FSS) technology was developed to meet the demands of joining materials with drastically different properties and melting regimes. The process enables joining of light metals like magnesium and aluminum to high temperature materials like steel and titanium. Viable joints between polymer composites and metal can also be made using this method. This paper will present the state of the art, progress made, and challenges associated with this innovative derivative of friction stir welding (FSW) in reference to joining dissimilar metals and polymer/metal combinations.

8LPP Logic Platform Technology for Cost-Effective High Volume Manufacturing

2018 ◽  
Author(s):  
Hwasung Rhee ◽  
Ilryong Kim ◽  
Jaehun Jeong ◽  
Nakjin Son ◽  
Heebum Hong ◽  
...  
Keyword(s):  
Cost Effective ◽  
High Volume ◽  
Platform Technology

scholarly journals The Technique and Cost of Radiosurgery for the Treatment of 1-3 Brain Metastases

2013 ◽  
Vol 40 (6) ◽  
pp. 795-799
Author(s):  
Waseem Sharieff ◽  
Anthony Whitton ◽  
Tom Chow ◽  
Doug Wyman ◽  
James Wright ◽  
...  
Keyword(s):  
Incremental Cost ◽  
Cost Effective ◽  
High Volume ◽  
Sensitivity Analyses ◽  
Patient Volume ◽  
Multiple Lesions ◽  
Robotic Radiosurgery ◽  
The Mean ◽  
Main Determinants ◽  
The Cost

Background:Radiosurgery can be delivered through a variety of modalities including robotic and fixed gantry linacbased systems. They appear equally effective and safe. Thus, community need and costs remain the main determinants for choosing a given modality. We performed an economic evaluation to identify settings in which one modality could be preferred over the other.Methods:Using local estimates of resource volumes and unit prices, we computed the incremental cost/patient of robotic radiosurgery compared to fixed-gantry radiosurgery from a payer's perspective. By varying parameters of resource volumes, we performed a probabilistic analysis stratified by number of brain lesions. in addition, we performed sensitivity analyses to examine the effect of patient volume on cost/patient.Results:The cost of robotic radiosurgery was $4,783/patient, and cost of fixed-gantry radiosurgery was $5,166/patient. The mean incremental cost was $-383 (95% interval: $-670, $110) for all lesions, $78 ($23, $123) for solitary lesions, and $-610 ($-679, $-534) for multiple lesions. The cost/patient of robotic radiosurgery varied from $5,656 (low volume setting) to $4,492 (high volume setting).Conclusion:in settings of moderate to high volume (6-10 hours of daily operation), and in multiple lesions, robotic radiosurgery is more cost effective than fixed-gantry radiosurgery.

scholarly journals Is Outpatient Thyroid Surgery for Everyone?

2017 ◽  
Vol 10 ◽  
pp. 117955061772442 ◽  
Author(s):  
Dale Butler ◽  
Sarah Oltmann
Keyword(s):  
Patient Outcomes ◽  
Postoperative Bleeding ◽  
Hospital Setting ◽  
Cost Effective ◽  
High Volume ◽  
Outpatient Setting ◽  
Current Trends ◽  
Surgeon Experience ◽  
Reduced Costs ◽  
Inpatient Basis

Thyroidectomy is a common surgical procedure. Traditionally, surgeons have performed thyroidectomy on an inpatient basis. However, consistent with current trends in surgery, some practices are transitioning thyroidectomy to an outpatient setting. Although concerns for hypocalcemia and postoperative bleeding exist regardless of surgeon experience, multiple studies demonstrate that outpatient thyroidectomy is safe in the hands of high-volume surgeons. Indeed, experienced thyroid surgeons who perform thyroidectomy in an outpatient setting experience excellent patient outcomes and reduced costs. However, outpatient thyroidectomy may not be suitable for all surgeons, hospitals, or patients. When evaluating whether to implement an outpatient thyroid program, a practice should consider a number of important factors including the team performing the procedure, the hospital, and the patient. With the appropriate staff education and experience, hospital setting, and patient selection, practices in a multitude of settings can successfully develop a safe, cost-effective outpatient thyroid program.

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