Implementing state of the art advanced process control and factory automation solutions at White Oak Semiconductor

2003 ◽  
Author(s):  
T. Urenda ◽  
T. Dowd ◽  
K. Dimond ◽  
B. Schulze
Keyword(s):  
Process Control ◽  
State Of The Art ◽  
White Oak ◽  
Advanced Process Control ◽  
Factory Automation

Increasing revenue and reducing cost through the use of advanced process control technology in the sugar industry

2016 ◽  
pp. 620-624
Author(s):  
Scott Kahre
Keyword(s):  
Process Control ◽  
Sugar Industry ◽  
Operating Cost ◽  
Control Technology ◽  
Advanced Process Control ◽  
Output Controller ◽  
Complex Processes ◽  
Unit Operations ◽  
Sugar Unit ◽  
Optimum Cost

Advanced process control technology can provide sugar processors the ability to realize major revenue enhancements and/or operating cost reductions with low initial investment. One technology in particular, model predictive control (MPC), holds the potential to increase production, reduce energy costs, and reduce quality variability in a wide variety of major sugar unit operations. These include centrifugal stations, pulp dryers, extractors, diffusers, mills, evaporating crystallizers, juice purification, and more. Simple payback periods as low as two months are projected. As a PC-based add-on to existing distributed control systems (DCS) or programmable logic controller (PLC) systems, MPC acts as a multi-input, multi-output controller, utilizing predictive process response models and optimization functions to control complex processes to their optimum cost and quality constraints.

Implementation and benefits of advanced process control for lithography CD and overlay

2003 ◽  
Author(s):  
Lena Zavyalova ◽  
Chong-Cheng Fu ◽  
Gary S. Seligman ◽  
Perry A. Tapp ◽  
Victor Pol
Keyword(s):  
Process Control ◽  
Advanced Process Control

Cost and revenue impact of advanced process control (APC) with an emphasis on run-to-run control (R2R)

2003 ◽  
Author(s):  
Timothy D. Stanley ◽  
Richard J. Markle ◽  
Brad Van Eck ◽  
Brian K. Cusson ◽  
Matthew A. Purdy ◽  
...  
Keyword(s):  
Process Control ◽  
Advanced Process Control

Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices

2015 ◽  
Vol 821-823 ◽  
pp. 528-532 ◽  
Author(s):  
Dirk Lewke ◽  
Karl Otto Dohnke ◽  
Hans Ulrich Zühlke ◽  
Mercedes Cerezuela Barret ◽  
Martin Schellenberger ◽  
...  
Keyword(s):  
Experimental Data ◽  
Process Control ◽  
Tool Wear ◽  
Large Scale ◽  
State Of The Art ◽  
Scale Production ◽  
High Quality ◽  
Large Scale Production ◽  
Laser Separation

One challenge for volume manufacturing of 4H-SiC devices is the state-of-the-art wafer dicing technology – the mechanical blade dicing which suffers from high tool wear and low feed rates. In this paper we discuss Thermal Laser Separation (TLS) as a novel dicing technology for large scale production of SiC devices. We compare the latest TLS experimental data resulting from fully processed 4H-SiC wafers with results obtained by mechanical dicing technology. Especially typical product relevant features like process control monitoring (PCM) structures and backside metallization, quality of diced SiC-devices as well as productivity are considered. It could be shown that with feed rates up to two orders of magnitude higher than state-of-the-art, no tool wear and high quality of diced chips, TLS has a very promising potential to fulfill the demands of volume manufacturing of 4H-SiC devices.

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