A linear-time eigenvalue solver for finite-element-based analysis of large-scale wave propagation problems in on-chip interconnect structures

2008 IEEE Antennas and Propagation Society International Symposium ◽

10.1109/aps.2008.4619427 ◽

2008 ◽

Author(s):

Jongwon Lee ◽

V. Balakrishnan ◽

Cheng-Kok Koh ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Wave Propagation ◽

Large Scale ◽

Linear Time ◽

On Chip ◽

Eigenvalue Solver

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A Linear-Time Complex-Valued Eigenvalue Solver for Full-Wave Analysis of Large-Scale On-Chip Interconnect Structures

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2009.2025457 ◽

2009 ◽

Vol 57 (8) ◽

pp. 2021-2029 ◽

Cited By ~ 5

Author(s):

Jongwon Lee ◽

V. Balakrishnan ◽

Cheng-Kok Koh ◽

Dan Jiao

Keyword(s):

Large Scale ◽

Linear Time ◽

Wave Analysis ◽

Full Wave ◽

Full Wave Analysis ◽

On Chip ◽

Complex Valued ◽

Eigenvalue Solver

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A unified finite-element solution from zero frequency to microwave frequencies for full-wave modeling of large-scale three-dimensional on-chip interconnect structures

2008 IEEE Antennas and Propagation Society International Symposium ◽

10.1109/aps.2008.4618921 ◽

2008 ◽

Author(s):

Jianfang Zhu ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Large Scale ◽

Three Dimensional ◽

Finite Element Solution ◽

Element Solution ◽

Wave Modeling ◽

Microwave Frequencies ◽

Full Wave ◽

On Chip ◽

Zero Frequency

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Fast iterative solution algorithms for the frequency-domain layered finite-element based analysis of large-scale on-chip interconnect structures

2008 IEEE-EPEP Electrical Performance of Electronic Packaging ◽

10.1109/epep.2008.4675922 ◽

2008 ◽

Author(s):

Feng Sheng ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Frequency Domain ◽

Large Scale ◽

Iterative Solution ◽

Solution Algorithms ◽

On Chip

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A Unified Finite-Element Solution From Zero Frequency to Microwave Frequencies for Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2008.924232 ◽

2008 ◽

Vol 31 (4) ◽

pp. 873-881 ◽

Cited By ~ 14

Author(s):

Jianfang Zhu ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Large Scale ◽

Three Dimensional ◽

Finite Element Solution ◽

Element Solution ◽

Wave Modeling ◽

Microwave Frequencies ◽

Full Wave ◽

On Chip ◽

Zero Frequency

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A Linear-Complexity Finite-Element-Based Eigenvalue Solver for Efficient Analysis of 3-D On-Chip Integrated Circuits

IEEE Microwave and Wireless Components Letters ◽

10.1109/lmwc.2014.2361677 ◽

2014 ◽

Vol 24 (12) ◽

pp. 833-835 ◽

Cited By ~ 1

Author(s):

Jongwon Lee ◽

Venkataramanan Balakrishnan ◽

Cheng-Kok Koh ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Integrated Circuits ◽

Linear Complexity ◽

On Chip ◽

Eigenvalue Solver

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Fast Structure-Aware Direct Time-Domain Finite-Element Solver for the Analysis of Large-Scale On-Chip Circuits

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2015.2472403 ◽

2015 ◽

Vol 5 (10) ◽

pp. 1477-1487 ◽

Cited By ~ 1

Author(s):

Woochan Lee ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Time Domain ◽

Large Scale ◽

On Chip

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From O(N) to O(M): Time-domain layered finite-element reduction-recovery methods for large scale electromagnetics-based analysis and design of on-chip circuits

2008 IEEE Antennas and Propagation Society International Symposium ◽

10.1109/aps.2008.4618923 ◽

2008 ◽

Cited By ~ 1

Author(s):

H. Gan ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Time Domain ◽

Large Scale ◽

Analysis And Design ◽

On Chip ◽

Recovery Methods

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A Layered Finite Element Method for High-Frequency Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

2006 IEEE Electrical Performane of Electronic Packaging ◽

10.1109/epep.2006.321164 ◽

2006 ◽

Cited By ~ 3

Author(s):

Dan Jiao ◽

Sourav Chakravarty ◽

Changhong Dai

Keyword(s):

Finite Element Method ◽

Finite Element ◽

High Frequency ◽

Large Scale ◽

Three Dimensional ◽

On Chip ◽

Element Method

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From O(k2N) to O(N): A fast complex-valued eigenvalue solver for large-scale on-chip interconnect analysis

2009 IEEE MTT-S International Microwave Symposium Digest ◽

10.1109/mwsym.2009.5165662 ◽

2009 ◽

Author(s):

Jongwon Lee ◽

Venkataramanan Balakrishnan ◽

Cheng-Kok Koh ◽

Dan Jiao

Keyword(s):

Large Scale ◽

On Chip ◽

Complex Valued ◽

Eigenvalue Solver

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From $O(k^{2}N)$ to $O(N)$: A Fast and High-Capacity Eigenvalue Solver for Full-Wave Extraction of Very Large Scale On-Chip Interconnects

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/tmtt.2009.2034301 ◽

2009 ◽

Vol 57 (12) ◽

pp. 3219-3228 ◽

Cited By ~ 11

Author(s):

Jongwon Lee ◽

V. Balakrishnan ◽

Cheng-Kok Koh ◽

Dan Jiao

Keyword(s):

Large Scale ◽

High Capacity ◽

Full Wave ◽

On Chip ◽

Eigenvalue Solver

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