Power plane with planar electromagnetic bandgap structures for EMI reduction in high speed circuits

2006 ◽  
Author(s):  
Jie Qin ◽  
O.M. Ramahi
Keyword(s):  
High Speed ◽  
Electromagnetic Bandgap ◽  
Emi Reduction

Efficient EMI reduction in multilayer PCB using novel wideband electromagnetic bandgap structures

2011 ◽  
Vol 21 (4) ◽  
pp. 363-370 ◽  
Author(s):  
Hui-Sen He ◽  
Xin-Quan Lai ◽  
Wen-Dan Xu ◽  
Jian-Guo Jiang ◽  
Ming-Xiang Zang ◽  
...  
Keyword(s):  
Electromagnetic Bandgap ◽  
Emi Reduction

scholarly journals Meander-DGS Effect on Electromagnetic Bandgap Structure for Power/Ground Noise Suppression in High-Speed Integrated Circuit Packages and PCBs

Electronics ◽  
2022 ◽  
Vol 11 (2) ◽  
pp. 211
Author(s):  
Myunghoi Kim
Keyword(s):  
Slow Wave ◽  
Integrated Circuit ◽  
Analytical Method ◽  
High Speed ◽  
Noise Suppression ◽  
Cutoff Frequency ◽  
Closed Form Expression ◽  
Electromagnetic Bandgap ◽  
Ground Noise ◽  
The Impact

In this paper, we present the impact of a meander-shaped defected ground structure (MDGS) on the slow-wave characteristics of a lowest-order passband and a low cutoff frequency of the first stopband of an electromagnetic bandgap (EBG) structure for power/ground noise suppression in high-speed integrated circuit packages and printed circuit boards (PCBs). A semi-analytical method is presented to rigorously analyze the MDGS effect. In the analytical method, a closed-form expression for a low cutoff frequency of the MDGS-EBG structure is extracted with an effective characteristic impedance and a slow-wave factor. The proposed analytical method enables the fast analysis of the MDGS-EBG structure so that it can be easily optimized. The analysis of the MDGS effect revealed that the low cutoff frequency increases up to approximately 19% while comparing weakly and strongly coupled MDGSs. It showed that the miniaturization of the MDGS-EBG structure can be achieved. It was experimentally verified that the low cutoff frequency is reduced from 2.54 GHz to 2.00 GHz by decreasing the MDGS coupling coefficient, which is associated with the miniaturization of the MDGS-EBG structure in high-speed packages and PCBs.

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