Simple method for analyzing slot antennas on thick dielectric substrate

2002 ◽  
Author(s):  
A. Nesic ◽  
S. Suvakov ◽  
M. Mikavica
Keyword(s):  
Dielectric Substrate ◽  
Slot Antennas ◽  
Simple Method

Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated Layers on Metal Core PCB

2010 ◽  
Vol 2010 (1) ◽  
pp. 000127-000130
Author(s):  
Bernd Scholz ◽  
Ismir Pekmic ◽  
Syed Sajid Ahmad ◽  
Aaron Reinholz
Keyword(s):  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Metal Layer ◽  
Peel Test ◽  
Dielectric Substrate ◽  
Adhesive Tape ◽  
Metal Core ◽  
Simple Method ◽  
Core Technology ◽  
Metal Layers

Conventional printed circuit boards (PCBs) may be replaced by thinner metal-core boards for some applications, as well as for package substrates. Using thin, metal-core technology may provide advantages for radio frequency (RF) circuits and packages, and increase heat dissipation for high power applications. The metal-core technology discussed in this paper has several layers including the metal core, electro-coated dielectric, sputtered metal layers, and electroplated copper. For PCB and substrate reliability, it is important to have sufficient adhesion between the dielectric layer and plated copper. Sputtered metal layers with cleaning pre-treatments are one of the methods to improve the interfacial adhesion. This paper describes an efficient testing method for the adhesion of a thin sputtered metal layer to a dielectric substrate. In this method, adhesive tape was attached to the surface and peeled off at 90 degrees in a tensile tester. Due to the sub-micron thickness of the sputtered layers, conventional peel test methods could not be applied. Typical adhesion testing of upper layers like paint coatings use a lattice pattern. The new method provided a convenient, repeatable way to evaluate the adhesion of three different sputtered metals with fifteen different pretreatment combinations. The test results were used to choose the sputtered metal and were later confirmed by testing the copper plated assembly using the metal adhesion specification in the industry standard IPC-TM-650. A review of other methods and the need to identify an easy to use method which can provide repeatable quantitative measurements.

A simple way for producing holographic filters suitable for image improvement

1978 ◽  
Vol 36 (1) ◽  
pp. 226-227
Author(s):  
K.-H. Herrmann ◽  
E. Reuber ◽  
P. Schiske
Keyword(s):  
Transfer Functions ◽  
Diffraction Order ◽  
Lateral Position ◽  
Simple Method ◽  
Spatial Frequencies ◽  
Resolution Electron ◽  
Wiener Filters ◽  
Image Improvement ◽  
Optical Reconstruction ◽  
Set Up

Aposteriori deblurring of high resolution electron micrographs of weak phase objects can be performed by holographic filters [1,2] which are arranged in the Fourier domain of a light-optical reconstruction set-up. According to the diffraction efficiency and the lateral position of the grating structure, the filters permit adjustment of the amplitudes and phases of the spatial frequencies in the image which is obtained in the first diffraction order.In the case of bright field imaging with axial illumination, the Contrast Transfer Functions (CTF) are oscillating, but real. For different imageforming conditions and several signal-to-noise ratios an extensive set of Wiener-filters should be available. A simple method of producing such filters by only photographic and mechanical means will be described here.A transparent master grating with 6.25 lines/mm and 160 mm diameter was produced by a high precision computer plotter. It is photographed through a rotating mask, plotted by a standard plotter.

Rotary Beveling for In Situ Thin-Section Microscopy of Cell Cultures

1981 ◽  
Vol 39 ◽  
pp. 550-551
Author(s):  
Dean A. Handley ◽  
Jack T. Alexander ◽  
Shu Chien
Keyword(s):  
Cell Growth ◽  
Cell Cultures ◽  
Molecular Interactions ◽  
Convenient Method ◽  
Petri Dish ◽  
Simple Method ◽  
Thin Section Microscopy ◽  
Thin Sectioning ◽  
Organic Fluids

In situ preparation of cell cultures for ultrastructural investigations is a convenient method by which fixation, dehydration and embedment are carried out in the culture petri dish. The in situ method offers the advantage of preserving the native orientation of cell-cell interactions, junctional regions and overlapping configurations. In order to section after embedment, the petri dish is usually separated from the polymerized resin by either differential cryo-contraction or solvation in organic fluids. The remaining resin block must be re-embedded before sectioning. Although removal of the petri dish may not disrupt the native cellular geometry, it does sacrifice what is now recognized as an important characteristic of cell growth: cell-substratum molecular interactions. To preserve the topographic cell-substratum relationship, we developed a simple method of tapered rotary beveling to reduce the petri dish thickness to a dimension suitable for direct thin sectioning.

Development of a simple method for the determination of single nucleotide polymorphisms

2010 ◽  
Vol 34 (8) ◽  
pp. S75-S75
Author(s):  
Weifeng Zhu ◽  
Zhuoqi Liu ◽  
Daya Luo ◽  
Xinyao Wu ◽  
Fusheng Wan
Keyword(s):  
Single Nucleotide Polymorphisms ◽  
Nucleotide Polymorphisms ◽  
Simple Method ◽  
Single Nucleotide
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