scholarly journals Degradation Data Analysis Using a Wiener Degradation Model With Three-Source Uncertainties

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 37896-37907 ◽  
Author(s):  
Donghui Pan ◽  
Siliang Lu ◽  
Yongbin Liu ◽  
Wenzhi Yang ◽  
Jia-Bao Liu
Keyword(s):  
Data Analysis ◽  
Degradation Model ◽  
Degradation Data

A nonlinear Wiener degradation model integrating degradation data under accelerated stresses and real operating environment

2020 ◽  
pp. 1748006X2097809
Author(s):  
Li Sun ◽  
Fangchao Zhao ◽  
Narayanaswamy Balakrishnan ◽  
Honggen Zhou ◽  
Xiaohui Gu
Keyword(s):  
Remaining Useful Life ◽  
Normal Stresses ◽  
Operating Environment ◽  
Unknown Parameters ◽  
Step Method ◽  
Degradation Model ◽  
Accelerated Degradation ◽  
Degradation Data ◽  
Proposed Model ◽  
The Difference

Remaining useful life (RUL) prediction in real operating environment (ROE) plays an important role in condition-based maintenance. However, the life information in ROE is limited, especially for some long-life products. In such cases, accelerated degradation test (ADT) is an effective method to collect data and then the accelerated degradation data are converted to normal level of accelerated stresses through acceleration factors. However, the stresses in ROE are different from normal stresses since there are some other stresses except normal stresses, which cannot be accelerated, but still have impact on the degradation. To predict the RUL in ROE, a nonlinear Wiener degradation model is proposed based on failure mechanism invariant principle which is the precondition and requirement of an ADT and a calibration factor is introduced to calibrate the difference between ROE and normal stresses. Moreover, the unit-to-unit variability is considered in the concern model. Based upon the proposed approach, the RUL distribution is derived in closed form. The unknown parameters in the model are obtained by a new two-step method through fuzing converted degradation data in normal stresses and degradation data in ROE. Finally, the validity of the proposed model is demonstrated through several simulation data and a case study.

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

2013 ◽  
Vol 135 (4) ◽  
Author(s):  
Bo Tao ◽  
Guanghua Wu ◽  
Zhouping Yin ◽  
Youlun Xiong
Keyword(s):  
Shear Strength ◽  
Experimental Testing ◽  
Theoretical Models ◽  
Strength Degradation ◽  
Conductive Adhesive ◽  
Degradation Model ◽  
Anisotropic Conductive Adhesive ◽  
Degradation Data ◽  
Shear Strength Degradation ◽  
Relationship Of

Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal conditions was formulated through experimental testing and theoretical modeling. The shear strength degradation data were obtained from different hygrothermal aging tests and the ACA moisture properties were characterized for the corresponding hygrothermal conditions. Theoretical models considering the hygrothermal factors of T (temperature), RH (relative humidity), and t (time), were used to fit the shear strength degradation data. It was found that the inverse exponential law was the best candidate model to predict the degradation data. The shear strength degradation model of ACA joints under hygrothermal conditions was proposed, where the relationship of the S (shear strength) and the hygrothermal factors (T, RH, and t) was expressed in an analytical model. The degradation model was validated by experiments, and the model predictions agreed well with the test results.

scholarly journals Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1813
Author(s):  
Longteng Li ◽  
Bo Jing ◽  
Jiaxing Hu
Keyword(s):  
Solder Joint ◽  
Crack Propagation ◽  
Integrated Circuit ◽  
Solder Joints ◽  
Propagation Time ◽  
Strain Accumulation ◽  
Degradation Model ◽  
Accumulation Time ◽  
Degradation Data ◽  
Coupled Stress

The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip solder joints as the study object. First, solder joint degradation data and failure samples were obtained through fatigue tests under coupled stress. Three types of micro failure modes of solder joints were obtained by scanning electron microscope (SEM) analysis and finite element model (FEM) simulation results. Second, the characterization of degradation data was obtained by the principal component of Mahalanobis distance (PCMD) algorithm. It is found that solder joint degradation is divided into three stages: strain accumulation stage, crack propagation stage, and failure stage. Later, Coffin–Manson model and Paris model were modified based on the PCMD health index and strain simulation. The function relationship between strain accumulation time, crack propagation time, and strain was determined, respectively. Solder joint degradation models at different degradation stage were established. Finally, through strain simulation, the models can predict the strain accumulation time and failure time effectively under each failure mode, and their prediction accuracy is above 85%.

scholarly journals Bias reduction in the two-stage method for degradation data analysis

2020 ◽  
Vol 77 ◽  
pp. 1413-1424
Author(s):  
Ancha Xu ◽  
You-Gan Wang ◽  
Shurong Zheng ◽  
Fengjing Cai
Keyword(s):  
Data Analysis ◽  
Bias Reduction ◽  
Two Stage ◽  
Degradation Data

Degradation data analysis for samples under unequal operating conditions: a case study on train wheels

2012 ◽  
Vol 39 (12) ◽  
pp. 2721-2739 ◽  
Author(s):  
Julio C. Ferreira ◽  
Marta A. Freitas ◽  
Enrico A. Colosimo
Keyword(s):  
Data Analysis ◽  
Operating Conditions ◽  
Degradation Data
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