scholarly journals 3D Printed Alumina for Low-Loss Millimeter Wave Components

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 40719-40724 ◽  
Author(s):  
Alejandro Jimenez-Saez ◽  
Martin Schubler ◽  
Christopher Krause ◽  
Damian Pandel ◽  
Kamil Rezer ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
3D Printed

Rapid prototyping of low loss 3D printed waveguides for millimeter-wave applications

2017 ◽  
Author(s):  
Junyu Shen ◽  
Michael W. Aiken ◽  
Morteza Abbasi ◽  
Dishit P. Parekh ◽  
Xin Zhao ◽  
...  
Keyword(s):  
Rapid Prototyping ◽  
Millimeter Wave ◽  
Low Loss ◽  
3D Printed

Low-Loss 3D-Coplanar Line Structure for Millimeter Wave Applications Using Laser Direct Structuring Technology

2021 ◽  
Author(s):  
S. Seewald ◽  
D. Manteuffel ◽  
M. Wolf ◽  
M. Barth ◽  
W. Eberhardt ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Coplanar Line ◽  
Line Structure

A low-loss compact stripline low-pass filter for millimeter-wave applications

2016 ◽  
Author(s):  
A. Gomez-Torrent ◽  
I. Arregui ◽  
J.D. Martinez ◽  
F. Teberio ◽  
J. V. M. Sanchez de Rojas ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Pass Filter ◽  
Low Pass Filter ◽  
Low Pass

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

Sign in / Sign up

Export Citation Format

Share Document