scholarly journals A Machine Vision Based Automatic Optical Inspection System for Measuring Drilling Quality of Printed Circuit Boards

IEEE Access ◽  
2017 ◽  
Vol 5 ◽  
pp. 10817-10833 ◽  
Author(s):  
Wei-Chien Wang ◽  
Shang-Liang Chen ◽  
Liang-Bi Chen ◽  
Wan-Jung Chang
Keyword(s):  
Machine Vision ◽  
Printed Circuit Boards ◽  
Inspection System ◽  
Circuit Boards ◽  
Automatic Optical Inspection ◽  
Printed Circuit ◽  
Optical Inspection ◽  
Drilling Quality ◽  
Optical Inspection System

Fast Precise Positioning of Circular Mark in Automatic Optical Inspection

2013 ◽  
Vol 325-326 ◽  
pp. 1614-1618
Author(s):  
Guang Jie Xiong ◽  
Yu Fei Liu ◽  
Rui Zhen Liu
Keyword(s):  
Printed Circuit Boards ◽  
Positioning Error ◽  
Circuit Boards ◽  
Precise Positioning ◽  
Automatic Optical Inspection ◽  
Running Time ◽  
Printed Circuit ◽  
Optical Inspection ◽  
Positioning Method ◽  
The Difference

Captured circular marks are deformed sometimes when Automatic Optical Inspection (AOI) is used to detect various defects on Printed Circuit Boards (PCB), which may affect the precision of inspection. A new accurate positioning method of circular marks is proposed to solve the problem by obtaining the center of the most round ellipse based on the criterion that the ratio of the difference between the length and width of its circumscribed rectangle and the width of the rectangle is less than 0.1. The simulation tests show that, if the mark has much more deformations, the center positioning error of the proposed algorithm is about 0.013 pixels, and the running time is less than 40ms. Therefore, the proposed method provides good characteristics such as speediness, strong anti-interference ability and robustness.

scholarly journals A FPGA implementation of solder paste deposit on printed circuit boards error detector based in a bright and contrast algorithm

2007 ◽  
Vol 5 (02) ◽  
Author(s):  
A. De Luca-Pennacchia ◽  
M. Á. Sánchez-Martí­nez
Keyword(s):  
Printed Circuit Boards ◽  
Computational Time ◽  
Inspection System ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Optical Inspection ◽  
Error Detector ◽  
Time Requirements ◽  
Computational Time Cost

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be implemented on FPGA, which could be incorporated to an automatic inspection system. The hardware implementation of the algorithm allows us to fulfill time requirements demanded by industry.

METHODS OF IMPROVING QUALITY OF PATTERN RECOGNITION BY OPTICAL INSPECTION SYSTEMS WHEN MOUNTING ELECTRONIC COMPONENTS

2019 ◽  
pp. 27-30
Author(s):  
A. A. Korneev ◽  
S. A. Glebov
Keyword(s):  
Printed Circuit Boards ◽  
The Body ◽  
Visual Images ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Optical Inspection ◽  
Inspection Systems ◽  
And Performance

The paper considers various systems for monitoring the installation of radio‑electronic devices, which includes both optical and combined systems. Also, the latest complexes of 3D automatic optical inspection (AOI) of the quality of installation of electronic components on printed circuit boards (PCB), which increase the accuracy and performance of the test and eliminate many defects during installation of components that are not available in the 2D inspection mode, are considered. Such defects include the height of the solder fillet, the angle of inclination of the body of the element, the height of the raising of the pins. The paper proposes a technique to improve the perception of visual images of components by applying several graphic images of the same component, presented in three additive color models. Improving the recognition of the outlines of components allows you to eliminate defects during the inspection at the stage of inspection of defects, while the electronic units can be repaired.

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