Selection of IR detectors for a fast laser soldering process with simultaneous solder joint qualification

1994 ◽  
Vol 17 (4) ◽  
pp. 596-602
Author(s):  
J. Nicolics ◽  
D. Schrottmayer ◽  
L. Musiejovsky
Keyword(s):  
Solder Joint ◽  
Ir Detectors ◽  
Soldering Process ◽  
Laser Soldering ◽  
Selection Of

scholarly journals Study of a Laser Soldering Process for Fine-Pitch Leads (3rd Report)

1994 ◽  
Vol 60 (12) ◽  
pp. 1806-1810 ◽  
Author(s):  
Kohei MURAKAMI ◽  
Akira ADACHI ◽  
Jitsuho HIROTA ◽  
Masaharu YOSHIDA ◽  
Osamu HAYASHI ◽  
...  
Keyword(s):  
Soldering Process ◽  
Fine Pitch ◽  
Laser Soldering

Reliability analysis of low-Ag BGA solder joints using four failure criteria

2012 ◽  
Vol 2012 (1) ◽  
pp. 000066-000072
Author(s):  
Erin Kimura ◽  
Jianbiao Pan
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Failure Criterion ◽  
Control Charts ◽  
Failure Criteria ◽  
Life Estimation ◽  
Resistance Increase ◽  
Estimate Reliability ◽  
Accelerated Thermal Cycling ◽  
Selection Of

The appropriate selection of failure criterion for solder joint studies is necessary to correctly estimate reliability life. The objective of this study is to compare the effect of different failure criteria on the reliability life estimation. The four failure criteria in this study are a 20% resistance increase defined in the IPC-9701A standard, a resistance beyond 500Ω, an infinite resistance (hard open), and a failure criterion based on X̄ and R control charts. Accelerated thermal cycling conditions of a low-silver BGA study included 0°C to 100 °C with ten minute dwell times and −40°C to 125°C with ten minute dwell times. The results show that the life estimation based on X̄ and R failure criterion is very similar to the life estimation when a 20% resistance increase defined in the IPC-9701A failure criterion is used. The results also show that the reliability life would be overestimated if the failure criterion of a resistance threshold of 500Ω or an infinite resistance (hard open) is used.

Reinforced Solder Technology for Increased Reliability

2017 ◽  
Vol 2017 (1) ◽  
pp. 000641-000645
Author(s):  
Tim Jensen ◽  
Sunny Neoh ◽  
Adam Murling
Keyword(s):  
Melting Point ◽  
Solder Joint ◽  
Solder Joints ◽  
Reliability Of Solder Joints ◽  
Impact Reliability ◽  
Selection Of

Abstract The reliability of solder joints have been studied for many years. The selection of a solder for a particular application is often limited based on melting point requirements. This limits the number of options that are available for use. When alloy selection options are limited, people look to process changes to try and improve the reliability. Two such areas that have been identified that can impact reliability are bondline control and void reduction. This paper analyzes a new reinforced solder technology to maintain a consistent solder joint bondline. Experiments were also conducted to determine how best to design these preforms to minimize voiding.

Selection of test paths for solder joint intermittent connection faults under DC stimulus

2018 ◽  
pp. 1-14 ◽  
Author(s):  
Li Huakang ◽  
Lv Kehong ◽  
Qiu Jing ◽  
Liu Guanjun ◽  
Chen Bailiang
Keyword(s):  
Solder Joint ◽  
Intermittent Connection ◽  
Selection Of

scholarly journals Influences of silicon carbide nanowires addition on IMC growth behavior of pure Sn solder during solid-liquid diffusion

2021 ◽  
Author(s):  
Mulan Li ◽  
Liang Zhang ◽  
Jiang Nan ◽  
Sujuan Zhong ◽  
Lei Zhang
Keyword(s):  
Silicon Carbide ◽  
Solder Joint ◽  
Ductile Fracture ◽  
Composite Solder ◽  
Mechanical Performance ◽  
Growth Behavior ◽  
Liquid Diffusion ◽  
Soldering Process ◽  
Solid Liquid ◽  
Pure Sn

Abstract In this paper, various mass fraction (0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) of silicon carbide nanowires (SiC) were incorporated into pure Sn solder to enhance the performances of Sn solder joint. The wetting behavior, shear strength and intermetallic compound (IMC) growth mechanism of Sn-xSiC/Cu solder during solid-liquid diffusion at 250°C was investigated systematically. The experiment results demonstrated that the wettability of Sn-xSiC/Cu solder had a significant improvement when the addition of SiC was up to 0.6 wt%, and excessive additives would degrade the wettability of the composite solder. The formation of the Cu6Sn5 IMC layer was observed at the Sn-xSiC solder/Cu interface. Meanwhile, SiC as an additive was conducive to restraining the growth of interfacial IMC during soldering process and the IMC thickness overtly fell down after doping 0.8 wt% SiC into Sn solder. Moreover, SiC addition would contribute to enhancing the mechanical performance of Sn solder joint. The fracture mechanism of solder joint changed from a mix of brittle and ductile fracture to a characteristic of typical ductile fracture.

scholarly journals Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering Process of Semiconductor Laser Diode

2021 ◽  
Author(s):  
Peidong Xu ◽  
Bin Wang ◽  
Yong Wang ◽  
Xiantao Wang
Keyword(s):  
Semiconductor Laser ◽  
Formation Mechanism ◽  
Laser Diodes ◽  
Void Formation ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Semiconductor Laser Diode ◽  
Soldering Technology ◽  
Semiconductor Laser Diodes ◽  
Selection Of

In this paper, the vacuum reflow soldering technology for semiconductor laser chips in optoelectronic devices was studied and analyzed in a systematic manner. Through the study on the key elements in the reflow soldering process, such as the selection of solders, <a>chamber</a> vacuum, flux, and the pressure applied by the fixture on the chip, this paper focused on exploring the formation mechanism of voids in the solder layer when the device was resoldered. Also, the change in the movement of gas bubbles in the voids with changing reflow oven chamber conditions and its underlying law were analyzed, by preparing 200 C-package semiconductor laser diodes and verifying the reliability and stability of the theoretical analysis through inspection and test aging. which could provide a theoretical basis for the use of the vacuum reflow soldering technology to reduce the void rate in the soldering process of devices.

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