Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation

Author(s):  
S. Rzepka ◽  
K. Banerjee ◽  
E. Meusel ◽  
Chenming Hu
2016 ◽  
Vol 3 (11) ◽  
pp. 115302 ◽  
Author(s):  
L Zheng ◽  
X Jiang ◽  
X H Deng ◽  
J R Yin ◽  
Y Jiang ◽  
...  

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