Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys

1996 ◽  
Vol 19 (2) ◽  
pp. 208-212 ◽  
Author(s):  
N.R. Bonda ◽  
I.C. Noyan
Keyword(s):  
Mechanical Properties ◽  
Specimen Size ◽  
Solder Alloys ◽  
Pbsn Solder

Study of mechanical properties of indium-based solder alloys for cryogenic applications

2022 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Madhuri Chandrashekhar Deshpande ◽  
Rajesh Chaudhari ◽  
Ramesh Narayanan ◽  
Harishwar Kale
Keyword(s):  
Mechanical Properties ◽  
Solder Alloy ◽  
Charpy Impact ◽  
Charpy Impact Test ◽  
Test Results ◽  
Solder Alloys ◽  
Content Type ◽  
Electron Microscope Analysis ◽  
American Society ◽  
Work Done

Purpose This study aims to develop indium-based solders for cryogenic applications. Design/methodology/approach This paper aims to investigate mechanical properties of indium-based solder formulations at room temperature (RT, 27 °C) as well as at cryogenic temperature (CT, −196 °C) and subsequently to find out their suitability for cryogenic applications. After developing these alloys, mechanical properties such as tensile and impact strength were measured as per American Society for Testing and Materials standards at RT and at CT. Charpy impact test results were used to find out ductile to brittle transition temperature (DBTT). These properties were also evaluated after thermal cycling (TC) to find out effect of thermal stress. Scanning electron microscope analysis was performed to understand fracture mechanism. Results indicate that amongst the solder alloys that have been studied in this work, In-34Bi solder alloy has the best all-round mechanical properties at RT, CT and after TC. Findings It can be concluded from the results of this work that In-34Bi solder alloy has best all-round mechanical properties at RT, CT and after TC and therefore is the most appropriate solder alloy amongst the alloys that have been studied in this work for cryogenic applications Originality/value DBTT of indium-based solder alloys has not been found out in the work done so far in this category. DBTT is necessary to decide safe working temperature range of the alloy. Also the effect of TC, which is one of the major reasons of failure, was not studied so far. These parameters are studied in this work.

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

2020 ◽  
Vol 31 (24) ◽  
pp. 22926-22932
Author(s):  
Hong-Sub Joo ◽  
Choong-Jae Lee ◽  
Kyung Deuk Min ◽  
Byeong-Uk Hwang ◽  
Seung-Boo Jung
Keyword(s):  
Mechanical Properties ◽  
Microstructural Evolution ◽  
Solder Alloys

Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping

1997 ◽  
Vol 26 (8) ◽  
pp. 954-958 ◽  
Author(s):  
M. Mccormack ◽  
H. S. Chen ◽  
G. W. Kammlott ◽  
S. Jin
Keyword(s):  
Mechanical Properties ◽  
Solder Alloys ◽  
Ag Doping
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