Analytical studies of the thermal stability of a high temperature superconducting tube

2001 ◽  
Vol 11 (1) ◽  
pp. 1836-1839
Author(s):  
J. Leveque ◽  
D. Netter ◽  
P. Masson ◽  
A. Rezzoug
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
High Temperature Superconducting ◽  
Analytical Studies ◽  
Thermal Stability Of

scholarly journals An Electromagnetic–Thermal Coupling Numerical Study of the Synchronous Generator with Second-Generation High-Temperature Superconducting Armatures

2020 ◽  
Vol 10 (15) ◽  
pp. 5228
Author(s):  
Xiangyu Huang ◽  
Zhen Huang ◽  
Xiaoyong Xu ◽  
Wan Li ◽  
Zhijian Jin
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Numerical Study ◽  
Short Circuit ◽  
Coated Conductors ◽  
Ac Loss ◽  
High Temperature Superconducting ◽  
Trade Offs ◽  
Short Circuit Fault ◽  
Thermal Stability Of

Generators with high-temperature superconducting armatures have an advantage in the fact that they can carry high currents. However, the AC loss of high-temperature superconducting (HTS) armatures is difficult to calculate precisely because HTS coils exist in a complex and time-varying electromagnetic environment. In addition, when the HTS coil is carrying a short circuit fault overcurrent, an electromagnetic–thermal simulation study of this process is required to ensure that the HTS coil is not damaged. In this paper, first, a fully coupled T-A formulation model is used to calculate the AC loss of HTS armatures. Then, the current and temperature distributions are simulated, considering the intrinsic characteristic of superconducting coated conductors, when the generator suffers the worst short circuit fault accidently. It is found that the turn with the lowest critical current quenches after 0.01 s, but the temperature rise cannot damage the coil if the circuit breaker can clear the fault quickly. The effects of the copper stabilizer thickness on the thermal stability of the HTS coil during the worst short circuit fault are also investigated. A thicker copper stabilizer improves the thermal stability of the HTS coil in the event of a short circuit fault, but the use of a simulation model is needed to make trade-offs between the engineering current density and the thermal stability of the HTS tapes. The work in this paper is necessary and can provide an important reference for manufacturing superconducting generators.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Increased Thermal Stability of Co-silicide Using Co-Ta Alloy Films

2001 ◽  
Vol 670 ◽  
Author(s):  
Min-Joo Kim ◽  
Hyo-Jick Choi ◽  
Dae-Hong Ko ◽  
Ja-Hum Ku ◽  
Siyoung Choi ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Grain Boundary ◽  
Reaction Rate ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Alloy Films ◽  
Post Annealing ◽  
Alloy Process ◽  
Thermal Stability Of

ABSTRACTThe silicidation reactions and thermal stability of Co silicide formed from Co-Ta/Si systems have been investigated. In case of Co-Ta alloy process, the formation of low resistive CoSi2phase is delayed to about 660°C, as compared to conventional Co/Si system. Moreover, the presence of Ta in Co-Ta alloy films reduces the silicidation reaction rate, resulting in the strong preferential orientation in CoSi2 films. Upon high temperature post annealing in the furnace, the sheet resistance of Co-silicide formed from Co/Si systems increases significantly, while that of Co-Ta/Si systems maintains low. This is due to the formation of TaSi2 at the grain boundaries and surface of Co-silicide films, which prevents the grain boundary migration thereby slowing the agglomeration. Therefore, from our research, increased thermal stability of Co-silicide films was successfully obtained from Co-Ta alloy process.

Thermal stability of nickel-cobalt multilayer silicide

2005 ◽  
Vol 891 ◽  
Author(s):  
Kil Jin Han ◽  
Yu Jung Cho ◽  
Soon Young Oh ◽  
Yong Jin Kim ◽  
Won Jae Lee ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Depth Profile ◽  
Ternary Phase ◽  
Nickel Silicide ◽  
Composition Gradient ◽  
Cobalt Silicide ◽  
Nickel Cobalt ◽  
Thermal Stability Of ◽  
Xps Depth Profile

ABSTRACTIn this study, we have investigated the structure of nickel-cobalt silicide to understand its behavior at high temperature. Nickel-cobalt silicide was formed after two-step RTP at 500°C and 700°C respectively. We could observe by TEM that nickel-cobalt silicide consists of a structure which seems to be a Ni-Co-Si ternary phase. No nickel silicide phases and cobalt silicide phases were detected in nickel-cobalt silicide by XRD. From XPS depth profile, we could confirm that there is a cobalt composition gradient along the silicide.

Thermal stability of high-temperature materials. Part 1

2004 ◽  
Vol 45 (5) ◽  
pp. 327-332 ◽  
Author(s):  
V. V. Kolomeitsev ◽  
S. A. Suvorov ◽  
E. F. Kolomeitseva
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
High Temperature Materials ◽  
Thermal Stability Of

scholarly journals Thermal stability of high temperature structural alloys

1999 ◽  
Author(s):  
C.E. Jordan ◽  
R.K. Rasefske ◽  
A. Castagna
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Thermal Stability Of
Sign in / Sign up

Export Citation Format

Share Document