Heat treatment study of Nb/sub 3/Sn strands for the Fermilab's high field dipole model

2000 ◽  
Vol 10 (1) ◽  
pp. 1000-1003 ◽  
Author(s):  
E. Barzi ◽  
C. Boffo ◽  
P.J. Limon ◽  
J.P. Ozelis ◽  
R. Yamada ◽  
...  
Author(s):  
N. Andreev ◽  
D. Chichili ◽  
C. Christensen ◽  
J. DiMarco ◽  
V.V. Kashikhin ◽  
...  

1996 ◽  
Vol 32 (4) ◽  
pp. 2097-2100 ◽  
Author(s):  
J. Ahlback ◽  
D. Leroy ◽  
L. Oberli ◽  
D. Perini ◽  
J. Salminen ◽  
...  
Keyword(s):  

MRS Advances ◽  
2015 ◽  
Vol 1 (17) ◽  
pp. 1137-1148 ◽  
Author(s):  
Yoshikazu Sakai ◽  
Takaaki Hibaru ◽  
Kiyoshi Miura ◽  
Akira Matsuo ◽  
Koushi Kawaguchi ◽  
...  

ABSTRACTOne of the authors developed the high strength and high conductivity Cu-24 wt% Ag alloy as a conductor material for high field magnets twenty years ago.Wire and sheet of the alloy have been used as a conductor material for pulsed magnets or resistive magnets of the high magnetic field facilities of each country. However, the alloy required large quantities of Ag addition to achieve high strength. The cost performance and workability of the alloy were not good for that. So, we investigated possibility of low Cu-Ag alloy for decreasing in material cost and improving in workability. We succeeded in the development of the Cu-6 wt% Ag alloy by the new heat treatment which is superior to the characteristic of the Cu-24 wt% Ag alloy even if the amount of Ag content is decreased in 1/4.At present, we make a lot of high field pulsed magnets by using the Cu-6 wt% Ag wire manufactured industrially, and do that magnetic field experiment and are getting good results at the ISSP, the university of Tokyo. We will talk about the characteristic, new heat treatment method and the manufacturing process of the conductor material for the Cu-6 wt% Ag alloy.


1997 ◽  
Vol 36 (Part 2, No. 6A) ◽  
pp. L673-L675 ◽  
Author(s):  
Kazuo Watanabe ◽  
Satoshi Awaji ◽  
Keiichi Kimura

1988 ◽  
Vol 327 ◽  
pp. 222 ◽  
Author(s):  
D. T. Wickramasinghe ◽  
Lilia Ferrario
Keyword(s):  

1988 ◽  
Vol 24 (2) ◽  
pp. 1373-1376 ◽  
Author(s):  
D. Leroy ◽  
R. Perin ◽  
G. de Rijk ◽  
W. Thomi
Keyword(s):  

Author(s):  
E. L. Thomas ◽  
S. L. Sass

In polyethylene single crystals pairs of black and white lines spaced 700-3,000Å apart, parallel to the [100] and [010] directions, have been identified as microsector boundaries. A microsector is formed when the plane of chain folding changes over a small distance within a polymer crystal. In order for the different types of folds to accommodate at the boundary between the 2 fold domains, a staggering along the chain direction and a rotation of the chains in the plane of the boundary occurs. The black-white contrast from a microsector boundary can be explained in terms of these chain rotations. We demonstrate that microsectors can terminate within the crystal and interpret the observed terminal strain contrast in terms of a screw dislocation dipole model.


Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


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