A quasi-microstrip traveling-wave power divider/combiner for use in high-density packages

1993 ◽  
Vol 3 (5) ◽  
pp. 148-149 ◽  
Author(s):  
D. Willems ◽  
I. Bahl ◽  
B. Kruger
2010 ◽  
Vol E93-C (11) ◽  
pp. 1648-1650 ◽  
Author(s):  
Yihong ZHOU ◽  
Jiayin LI ◽  
Haiyang WANG ◽  
Haiyan JIN

2020 ◽  
Vol 20 (2) ◽  
pp. 131-138
Author(s):  
Sung-June Hong ◽  
Min-Pyo Lee ◽  
Seil Kim ◽  
Jun-Su Lim ◽  
Dong-Wook Kim

In this paper, we present a Ku-band low-loss traveling-wave power divider that uses a hollow substrate integrated waveguide (HSIW). For easy connection with microstrip-based devices and circuits, a low-loss transition between the microstrip line and the HSIW structure was implemented using C-cut via holes at the discontinuity interface, which reduces radiation and leakage effects and improves mismatch performance. To validate the performance of the transition, a back-to-back microstrip-to-HSIW transition was designed, fabricated, and measured from 12.5 GHz to 15.5 GHz. The measured results showed a return loss of 18 dB or more and an insertion loss of 0.5 ± 0.07 dB. An HSIW-based, low-loss 1:3 traveling-wave power divider was fabricated and measured from 13.5 GHz to 14.5 GHz. The power divider showed a return loss of at least 21 dB, an insertion loss of 0.57 ± 0.03 dB, and a power combining efficiency of 87.1%–88.3%.


Sign in / Sign up

Export Citation Format

Share Document