A simple structure of low-loss large-angle abrupt-bend waveguide

2001 ◽  
Vol 13 (10) ◽  
pp. 1085-1087
Author(s):  
Sang-Pil Han ◽  
Choon-Gi Choi ◽  
Seung-Ho Ahn ◽  
Myung-Yung Jeong ◽  
Tae-Goo Choy
1995 ◽  
Vol 31 (6) ◽  
pp. 1131-1139 ◽  
Author(s):  
Han-Bin Lin ◽  
Jung-Young Su ◽  
Yu-Pin Liao ◽  
Way-Seen Wang

Electronics ◽  
2022 ◽  
Vol 11 (2) ◽  
pp. 219
Author(s):  
Tae-Hyeon Lee ◽  
Ki-Cheol Yoon ◽  
Kwang Gi Kim

A stepped impedance resonator (SIR) is suitable for designing a dual-band bandpass filter (BPF) that can be adjusted to reject spurious bands. A BPF is proposed using an SIR T-shaped meander line and folded structure. The BPF mainly comprises a meander line, a folded structure, and a T-shaped line. A novel BPF is used for the T-shaped line, which operates as a band-stop filter connecting to the center of the BPF. As a result, the complete BPF enables dual-band operation. The insertion and return losses of the first frequency passband (f01) are 0.024 and 17.3 dB, respectively, with a bandwidth of 46% at a center frequency of 2.801 GHz (2.2–3.48 GHz). The insertion and return losses of the second frequency passband (f02) are 0.026 and 17.2 dB, respectively, with a bandwidth of 10% at a center frequency of 4.351 GHz (4.13–4.55 GHz). The proposed BPF provides low loss, a simple structure, and a small size of only 4.29 × 4.08 mm, and it can be integrated into mobile communications systems.


Author(s):  
Fatima Brik ◽  
S. Harize ◽  
A. Fares ◽  
K. Saouchi

The S-Bend structures are heavily exploited to join optical components. Reducing the power loss caused by the curve is the main objective in the design step of these components. However integrated optical circuits require S-Bend waveguide to be low loss and compact sized. In this paper, we present a contribution to link the curved structure to the straight waveguide by using the simulated bend function available in the Beam propagation tool of the Rsoft commercial software package. Simulation results confirm that this approach allows a reduction of the size of the curved structure with offset with relatively minimum of losses for photonic field.


2021 ◽  
Author(s):  
Tetsu Morishima ◽  
Ken Manabe ◽  
Shuhei Toyokawa ◽  
Tetsuya Nakanishi ◽  
Tomomi Sano ◽  
...  

2008 ◽  
Vol 130 (5) ◽  
Author(s):  
R. J. Wood ◽  
S. Avadhanula ◽  
R. Sahai ◽  
E. Steltz ◽  
R. S. Fearing

Mobile microrobots with characteristic dimensions on the order of 1cm are difficult to design using either microelectromechanical systems technology or precision machining. This is due to the challenges associated with constructing the high strength links and high-speed, low-loss joints with micron scale features required for such systems. Here, we present an entirely new framework for creating microrobots, which makes novel use of composite materials. This framework includes a new fabrication process termed smart composite microstructures (SCM) for integrating rigid links and large angle flexure joints through a laser micromachining and lamination process. We also present solutions to actuation and integrated wiring issues at this scale using SCM. Along with simple design rules that are customized for this process, our new complete microrobotic framework is a cheaper, quicker, and altogether superior method for creating microrobots that we hope will become the paradigm for robots at this scale.


1995 ◽  
Vol 31 (4) ◽  
pp. 735-742 ◽  
Author(s):  
Han-Bin Lin ◽  
Wei-Lin Chen ◽  
Pei-Kuen Wei ◽  
Way-Seen Wang

2007 ◽  
Author(s):  
Xiang Ji ◽  
Hengwei Zhang ◽  
Guoguang Yang ◽  
Xiaomin Liu ◽  
Gang Lei

Author(s):  
David C. Joy ◽  
Dennis M. Maher

High-resolution images of the surface topography of solid specimens can be obtained using the low-loss technique of Wells. If the specimen is placed inside a lens of the condenser/objective type, then it has been shown that the lens itself can be used to collect and filter the low-loss electrons. Since the probeforming lenses in TEM instruments fitted with scanning attachments are of this type, low-loss imaging should be possible.High-resolution, low-loss images have been obtained in a JEOL JEM 100B fitted with a scanning attachment and a thermal, fieldemission gun. No modifications were made to the instrument, but a wedge-shaped, specimen holder was made to fit the side-entry, goniometer stage. Thus the specimen is oriented initially at a glancing angle of about 30° to the beam direction. The instrument is set up in the conventional manner for STEM operation with all the lenses, including the projector, excited.


Author(s):  
Oliver C. Wells

The low-loss electron (LLE) image in the scanning electron microscope (SEM) is useful for the study of uncoated photoresist and some other poorly conducting specimens because it is less sensitive to specimen charging than is the secondary electron (SE) image. A second advantage can arise from a significant reduction in the width of the “penetration fringe” close to a sharp edge. Although both of these problems can also be solved by operating with a beam energy of about 1 keV, the LLE image has the advantage that it permits the use of a higher beam energy and therefore (for a given SEM) a smaller beam diameter. It is an additional attraction of the LLE image that it can be obtained simultaneously with the SE image, and this gives additional information in many cases. This paper shows the reduction in penetration effects given by the use of the LLE image.


Author(s):  
C P Scott ◽  
A J Craven ◽  
C J Gilmore ◽  
A W Bowen

The normal method of background subtraction in quantitative EELS analysis involves fitting an expression of the form I=AE-r to an energy window preceding the edge of interest; E is energy loss, A and r are fitting parameters. The calculated fit is then extrapolated under the edge, allowing the required signal to be extracted. In the case where the characteristic energy loss is small (E < 100eV), the background does not approximate to this simple form. One cause of this is multiple scattering. Even if the effects of multiple scattering are removed by deconvolution, it is not clear that the background from the recovered single scattering distribution follows this simple form, and, in any case, deconvolution can introduce artefacts.The above difficulties are particularly severe in the case of Al-Li alloys, where the Li K edge at ~52eV overlaps the Al L2,3 edge at ~72eV, and sharp plasmon peaks occur at intervals of ~15eV in the low loss region. An alternative background fitting technique, based on the work of Zanchi et al, has been tested on spectra taken from pure Al films, with a view to extending the analysis to Al-Li alloys.


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