Low-loss extended cavity lasers by dielectric cap disordering with a novel masking technique

1993 ◽  
Vol 5 (4) ◽  
pp. 372-373 ◽  
Author(s):  
J. Beauvais ◽  
S.G. Ayling ◽  
J.H. Marsh
Keyword(s):  
Low Loss ◽  
Extended Cavity ◽  
Cavity Lasers

Very low loss extended cavity GaAs/AlGaAs lasers made by impurity-free vacancy diffusion

1994 ◽  
Vol 30 (2) ◽  
pp. 145-146 ◽  
Author(s):  
I. Gontijo ◽  
J.S. Roberts ◽  
R.M. De La Rue ◽  
J.H. Marsh ◽  
T. Krauss
Keyword(s):  
Vacancy Diffusion ◽  
Low Loss ◽  
Extended Cavity ◽  
Free Vacancy

Tolerant low-loss three-lens coupling system for 1.48-μm unstable-cavity lasers

2000 ◽  
Vol 12 (3) ◽  
pp. 254-256 ◽  
Author(s):  
S. Delepine ◽  
E. Boubal ◽  
E. Gerard ◽  
T. Fillion ◽  
P. Salet
Keyword(s):  
Low Loss ◽  
Coupling System ◽  
Unstable Cavity ◽  
Lens Coupling ◽  
Cavity Lasers

scholarly journals Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yilin Xu ◽  
Pascal Maier ◽  
Matthias Blaicher ◽  
Philipp-Immanuel Dietrich ◽  
Pablo Marin-Palomo ◽  
...  
Keyword(s):  
External Cavity ◽  
Heterogeneous Material ◽  
Single Mode ◽  
Monolithic Integration ◽  
Low Loss ◽  
External Feedback ◽  
Wire Bonds ◽  
External Cavity Lasers ◽  
Cavity Lasers ◽  
Photonic Wire

AbstractCombining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However, fabrication of such devices still relies on technologically demanding monolithic integration of heterogeneous material systems or requires costly high-precision package-level assembly, often based on active alignment, to achieve low-loss coupling between the SOA and the external feedback circuits. In this paper, we demonstrate a novel class of hybrid ECL that overcome these limitations by exploiting 3D-printed photonic wire bonds as intra-cavity coupling elements. Photonic wire bonds can be written in-situ in a fully automated process with shapes adapted to the mode-field sizes and the positions of the chips at both ends, thereby providing low-loss coupling even in presence of limited placement accuracy. In a proof-of-concept experiment, we use an InP-based reflective SOA (RSOA) along with a silicon photonic external feedback circuit and demonstrate a single-mode tuning range from 1515 to 1565 nm along with side mode suppression ratios above 40 dB and intrinsic linewidths down to 105 kHz. Our approach combines the scalability advantages of monolithic integration with the performance and flexibility of hybrid multi-chip assemblies and may thus open a path towards integrated ECL on a wide variety of integration platforms.

scholarly journals Measurement of reflectivity of butt-joint active-passive interfaces in integrated extended cavity lasers

2005 ◽  
Vol 17 (11) ◽  
pp. 2265-2267 ◽  
Author(s):  
Y. Barbarin ◽  
E.A.J.M. Bente ◽  
C. Marquet ◽  
E.J.S. Leclere ◽  
J.J.M. Binsma ◽  
...  
Keyword(s):  
Butt Joint ◽  
Extended Cavity ◽  
Cavity Lasers
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