Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers

2000 ◽  
Vol 23 (1) ◽  
pp. 80-85 ◽  
Author(s):  
K. Take ◽  
Y. Furukawa ◽  
S. Ushioda
Keyword(s):  
Heat Pipe ◽  
Heat Spreader ◽  
Fundamental Investigation ◽  
Notebook Computers

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

2000 ◽  
Vol 123 (3) ◽  
pp. 189-195 ◽  
Author(s):  
Koichiro Take ◽  
Ralph L. Webb
Keyword(s):  
Heat Pipe ◽  
Thermal Contact ◽  
Heat Pipes ◽  
Passive Cooling ◽  
Test Results ◽  
Air Flow Rate ◽  
Heat Spreader ◽  
Plate Heat ◽  
Cooling Method ◽  
Notebook Computers

The air flow rate available for cooling of notebook computers is very limited. Thus, notebook computer manufacturers desire a “passive” cooling method. Heat pipes are typically used to transport the heat from the CPU to a forced convection, air-cooled condenser. This paper describes a passive, keyboard sized aluminum Integrated Plate Heat Pipe (IP-HP) that has been developed for notebook computers. Analysis was performed to estimate the several thermal resistances in the heat pipe, including the effect of the vapor pressure drop. The modified design using a heat spreader at the evaporator significantly reduces the heat pipe resistance. Further work was done to evaluate the thermal contact resistance at the IP-HP/CPU interface. Test results show that the IP-HP can reject 18 W while maintaining the CPU 65°C above ambient temperature.

Innovative Configurations of Large Scale Heat Pipes

2005 ◽  
Author(s):  
Jessica Sheehan ◽  
Donald Jordan ◽  
Douglas T. Queheillalt ◽  
Pamela M. Norris
Keyword(s):  
Heat Pipe ◽  
Large Scale ◽  
Heat Pipes ◽  
Heat Spreader ◽  
Pipe System ◽  
Pipe Systems

A large-scale heat pipe is one of many possible solutions to the modern day problem of quickly dissipating high amounts of concentrated heat. While heat pipes are a proven technology, little research has been directed at large-scale heat pipe systems. Two configurations of large-scale heat pipes are investigated in this study. The two configurations examined were a 2’ × 2’ heat spreader plate (a type of heat pipe) and an innovative heat pipe system that combines traditional heat pipes and heat spreader plates. The heat spreader plate, when tested, quickly becomes isothermal and works as a traditional heat pipe. This demonstrates the ability of this large-scale heat pipe configuration to work effectively to spread out high amounts of deposited heat. The experimentation on the innovative heat pipe system gave similar results, showing that the configuration works as a traditional heat pipe.

The Particular Phenomenon of Pulsating Heat Pipe during its Operation Process

2011 ◽  
Vol 354-355 ◽  
pp. 1301-1304 ◽  
Author(s):  
Xun Wang ◽  
Xin Xin Mao ◽  
Lei Wang ◽  
Tong Han ◽  
Cheng Si Yang
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Operating Temperature ◽  
Operating Conditions ◽  
Pulsating Heat Pipe ◽  
Transfer Property ◽  
Experimental Data Processing ◽  
Fundamental Investigation ◽  
Operation Process ◽  
Heat Transfer Property

Combined with the existing research results, the heat transfer property of Pulsating Heat Pipe (PHP) was analyzed on the basis of experimental data processing in multi-operating conditions. PHP could self-repair when heat transfer was deteriorated, and the operating temperature continued to rise with the increased heating power during the operation. This study would contribute to the safe and effective operating; moreover, it could lay foundations for the fundamental investigation of PHP.

Hot Spot Elimination by Thin and Smart Heat Spreader

2015 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Masataka Mochizuki ◽  
Koichi Mashiko
Keyword(s):  
Heat Pipe ◽  
Hot Spot ◽  
Electronic Devices ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Metal Plate ◽  
Confined Space ◽  
Heat Spreader ◽  
Clock Speed ◽  
Wick Structure

Heat pipes are recognized as an excellent heat transport devices and extensively investigated for applications in electronic cooling. Different types of heat pipes have been developed such as micro/miniature heat pipes, loop heat pipes and so on, and these heat pipes have been widely applied in the field of electronics cooling such as notebook, desktop, data center; as well as aerospace, industrial cooling field. However, in recent years the application of heat pipe is widening to the filed of hand held mobile electronic devices such as smart phone, tablet pc, digital camera etc. With the development in technology these devices have different user friendly functions and capabilities, which requires the highest processor clock speed. In general, high clock speed of processor generates lot of heat which need to be spread or removed to eliminate the hot spot. It becomes a challenging task to cool such electronic devices as mentioned above with a very confined space and concentrated heat sources. Regarding to this challenge, ultra thin flat heat pipe is developed; this newly developed heat pipe consists of a special fiber wick structure which can ensure vapor spaces on the two sides of the wick structure. In this paper a novel thin spreader is proposed to eliminate the hot spot; generally the proposed heat spreader consists of 0.20mm thick metal plate and ultra thin heat pipe of 0.40mm thickness soldered in its body. Maximum thickness of this spreader is 0.63mm. Metal plate is 60mm × 110mm in size; and the ultra thin heat pipe can be fabricated from different original diameter ranges from 2.0mm to 3.0mm Cu tube. Theoretical and experimental analysis have been done to evaluate this thin spreader. In addition, some real application of this spreader will be introduced in this paper.

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

2011 ◽  
Author(s):  
Ahmad Jalilvand ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yoji Kawahara ◽  
Vijit Wuttijumnong ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Performance Test ◽  
Acoustic Noise ◽  
Test Results ◽  
Cooling Device ◽  
Heat Spreader ◽  
Cooling Fan ◽  
Thermal Solution ◽  
New Type ◽  
Cooling Module

A high-density and slim-type packaging technology in a notebook PC or a handheld PC has been developed as the importance of portability is increased more and more recently. The heat generated in small-sized electronic units should be dissipated effectively for operational stability during system lifetime. Considering the technical trend for miniaturized packaging of components, which requires very limited space, installed in the system; it is inevitable to develop and apply a micro-cooling device. In the present study, a very thin cooling device which operates on the basis of piezoelectricity has been introduced. First, the operation principal of Piezo fan is explained and then this new type of Piezo fan is introduced. Performance test results on thin laptop thermal solution module combined with this new Piezo fan is investigated. The original thermal solution module was composed of thin heat spreader (1 mm thick) and thin heat pipe (less than 2 mm) with finned heat sink at the condenser cooled by mini cooling fan (brushless mini fan). The mini fan is replaced by this new type of much thinner Piezo fan and then performance is studied and the results are compared with thin cooling module when cooled by mini cooling fan. In addition, this work consists of various developments that have been conducted to improve the performance of this Piezo fan that includes enhancement of cooling performance and reduction of acoustic noise.

Thermal performance of a flat polymer heat pipe heat spreader under high acceleration

2012 ◽  
Vol 22 (4) ◽  
pp. 045018 ◽  
Author(s):  
Christopher Oshman ◽  
Qian Li ◽  
Li-Anne Liew ◽  
Ronggui Yang ◽  
Y C Lee ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Spreader ◽  
High Acceleration ◽  
Pipe Heat

An Experimental Investigation of an Oscillating Heat Pipe Heat Spreader

2015 ◽  
Vol 7 (2) ◽  
Author(s):  
F. F. Laun ◽  
H. Lu ◽  
H. B. Ma
Keyword(s):  
Flat Plate ◽  
Heat Pipe ◽  
Heat Transport ◽  
Power Input ◽  
Heat Spreader ◽  
Oscillating Heat Pipe ◽  
Test Configuration ◽  
Central Heating ◽  
Center Section ◽  
Heat Transport Capability

With ever increasing technological advances in electronics, modern computer components continue to produce higher power densities that present a challenge to thermal management. A radial flat-plate oscillating heat pipe (RFP-OHP) heat spreader is investigated to study the effect of central heating on the heat transport capability in an OHP. The investigated OHP has dimensions of 100 mm × 100 mm × 2.5 mm with central heating using a 30 mm × 30 mm heater. Experimental results show that when heat is added to the center section of one side of the radial flat-plate OHP, and when heat is removed from the whole surface of another side of the heat pipe, the startup power for the oscillating motion increases. In addition, the spacer effect on the heat transport capability including the startup is investigated experimentally. The spacer added between the cooling block and OHP could lower the startup power for oscillatory motion. When compared to a copper slab of the same dimensions in the same test configuration, the temperature difference for the OHP with and without the additional copper spacer was reduced by a maximum of 46% and 25%, respectively, at a power input of 525 W and a heat flux of 58 W/cm2.

Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

2003 ◽  
Author(s):  
Tarek Jamal-Eddine ◽  
Lawrence Mok
Keyword(s):  
Numerical Model ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Acoustic Noise ◽  
Liquid Crystal Display ◽  
Thermal Contact ◽  
Metal Plate ◽  
Heat Spreader ◽  
Notebook Computer ◽  
Rotational Part

The power of semiconductor chips, especially the CPU chip used in the notebook computer, is increasing nowadays while the size of the computer box is decreasing. To cope with this ever-increasing heat load within the notebook computer, many design engineers tend to use bigger heat sinks and fans. However, these approaches add weight, acoustic noise, and power consumption to the computer, none of which is desirable. A method of transferring heat from a CPU chip to the backside of the liquid-crystal display (LCD) and letting heat dissipate into the surroundings has been explored before. This is sometimes called the thermal hinge method since heat is transferred across the hinge of a notebook computer. In this paper, the structure of a new thermal hinge and its thermal performance will be revealed. This new thermal hinge has two main parts: one is the base, which is stationary and which has a heat pipe connected to a metal plate on top of a CPU chip, and the other is the rotational part, which is mounted on the LCD cover with a heat pipe connected to a heat spreader. The base is supported by a set of springs to ensure that the base is always in good thermal contact with the rotational part of the hinge. This spring-loaded thermal hinge using an aluminum heat spreader on a plastic LCD cover was built and tested and the results were compared with a numerical model that was constructed using a commercially available CFD code. The results from the experiments and numerical modeling agree reasonably well. Because of this, the numerical model has been used to optimize the hinge structure. The effects of the size, thickness, and materials of the heat spreader as well as the materials of the LCD cover on the hinge thermal performance have been studied and will be discussed.

Metallic micro heat pipe heat spreader fabrication

2004 ◽  
Vol 24 (2-3) ◽  
pp. 299-309 ◽  
Author(s):  
Shung-Wen Kang ◽  
Sheng-Hong Tsai ◽  
Ming-Han Ko
Keyword(s):  
Heat Pipe ◽  
Heat Spreader ◽  
Micro Heat Pipe ◽  
Pipe Heat
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