Analytical method of calculating the transient and steady-state temperature rises for cable-bundle in tray and ladder

1998 ◽  
Vol 13 (3) ◽  
pp. 691-698 ◽  
Author(s):  
Song-Bo Liu ◽  
Xu Han
Author(s):  
Liang Zhu ◽  
Chenguang Diao

In recent years, mild or moderate hypothermia during which brain temperature is reduced to 30–35°C has been proposed for clinical use as an adjunct for achieving protection from cerebral ischemia and traumatic brain injury. There are two approaches for achieving a reduction in brain temperature. One is via systemic hypothermia where the whole body is cooled. This approach may produce deleterious systemic complications and require intensive monitoring. Another approach is called selective brain cooling (SBC) in which the brain is selectively cooled while the rest of the body is kept at normal temperature. Clinically feasible SBC protocols include head hood or helmet with water or chemical cooling, head immersion in iced water, nasophyaryngeal cooling after tracheal intubation, and intro-carotid flushing. Simply packing ice or wearing cooling helmet is easy to implement. Previous theoretical study [Zhu and Diao, 2001] suggests that it is feasible to achieve mild hypothermia via head surface cooling. However, most physicians believe that it takes a much longer time to reduce the brain temperature using head surface cooling. In this study, a three-dimensional theoretical model is developed to study the transient and steady state temperature distribution in the brain during SBC. The effect of regionally varying local blood perfusion rate in the brain tissue on the temporal and spatial temperature gradient is examined. Other factors including the brain size and the thermal contact resistance between the cooling medium and the head scalp are evaluated in the simulation.


Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3854
Author(s):  
Salvatore Musumeci ◽  
Luigi Solimene ◽  
Carlo Stefano Ragusa

In this paper, we propose a method for the identification of the differential inductance of saturable ferrite inductors adopted in DC–DC converters, considering the influence of the operating temperature. The inductor temperature rise is caused mainly by its losses, neglecting the heating contribution by the other components forming the converter layout. When the ohmic losses caused by the average current represent the principal portion of the inductor power losses, the steady-state temperature of the component can be related to the average current value. Under this assumption, usual for saturable inductors in DC–DC converters, the presented experimental setup and characterization method allow identifying a DC thermal steady-state differential inductance profile of a ferrite inductor. The curve is obtained from experimental measurements of the inductor voltage and current waveforms, at different average current values, that lead the component to operate from the linear region of the magnetization curve up to the saturation. The obtained inductance profile can be adopted to simulate the current waveform of a saturable inductor in a DC–DC converter, providing accurate results under a wide range of switching frequency, input voltage, duty cycle, and output current values.


2019 ◽  
Vol 39 (2) ◽  
pp. 262-271
Author(s):  
Yukan Hou ◽  
Yuan Li ◽  
Yuntian Ge ◽  
Jie Zhang ◽  
Shoushan Jiang

Purpose The purpose of this paper is to present an analytical method for throughput analysis of assembly systems with complex structures during transients. Design/methodology/approach Among the existing studies on the performance evaluation of assembly systems, most focus on the system performance in steady state. Inspired by the transient analysis of serial production lines, the state transition matrix is derived considering the characteristics of merging structure in assembly systems. The system behavior during transients is described by an ergodic Markov chain, with the states being the occupancy of all buffers. The dynamic model for the throughput analysis is solved using the fixed-point theory. Findings This method can be used to predict and evaluate the throughput performance of assembly systems in both transient and steady state. By comparing the model calculation results with the simulation results, this method is proved to be accurate. Originality/value This proposed modeling method can depict the throughput performance of assembly systems in both transient and steady state, whereas most exiting methods can be used for only steady-state analysis. In addition, this method shows the potential for the analysis of complex structured assembly systems owing to the low computational complexity.


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