Carrier lifetime extraction in fully depleted dual-gate SOI devices

1999 ◽  
Vol 20 (5) ◽  
pp. 209-211 ◽  
Author(s):  
T. Ernst ◽  
A. Vandooren ◽  
S. Cristoloveanu ◽  
J.-P. Colinge ◽  
D. Flandre
1999 ◽  
Vol 46 (7) ◽  
pp. 1503-1509 ◽  
Author(s):  
T. Ernst ◽  
S. Cristoloveanu ◽  
A. Vandooren ◽  
T. Rudenko ◽  
J.-P. Colinge

Author(s):  
T. Ernst ◽  
S. Cristoloveanu ◽  
A. Vandooren ◽  
J.-P. Colinge ◽  
T.E. Rudenko

Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1585
Author(s):  
Hanbin Wang ◽  
Jinshun Bi ◽  
Mengxin Liu ◽  
Tingting Han

This work investigates the different sensitivities of an ion-sensitive field-effect transistor (ISFET) based on fully depleted silicon-on-insulator (FDSOI). Using computer-aided design (TCAD) tools, the sensitivity of a single-gate FDSOI based ISFET (FDSOI-ISFET) at different temperatures and the effects of the planar dual-gate structure on the sensitivity are determined. It is found that the sensitivity increases linearly with increasing temperature, reaching 890 mV/pH at 75 °C. By using a dual-gate structure and adjusting the control gate voltage, the sensitivity can be reduced from 750 mV/pH at 0 V control gate voltage to 540 mV/pH at 1 V control gate voltage. The above sensitivity changes are produced because the Nernst limit changes with temperature or the electric field generated by different control gate voltages causes changes in the carrier movement. It is proved that a single FDSOI-ISFET can have adjustable sensitivity by adjusting the operating temperature or the control gate voltage of the dual-gate device.


2008 ◽  
Vol 55 (6) ◽  
pp. 3259-3264 ◽  
Author(s):  
Farah E. Mamouni ◽  
Sriram K. Dixit ◽  
Ronald D. Schrimpf ◽  
Philippe C. Adell ◽  
Ivan S. Esqueda ◽  
...  

2014 ◽  
Vol 778-780 ◽  
pp. 841-844 ◽  
Author(s):  
Koji Nakayama ◽  
Shuji Ogata ◽  
Toshihiko Hayashi ◽  
Tetsuro Hemmi ◽  
Atsushi Tanaka ◽  
...  

The reverse recovery characteristics of a 4H-SiC PiN diode under higher voltage and faster switching are investigated. In a high-voltage 4H-SiC PiN diode, owing to an increased thickness, the drift region does not become fully depleted at a relatively low voltage Furthermore, an electron–hole recombination must be taken into account when the carrier lifetime is equal to or shorter than the reverse recovery time. High voltage and fast switching are therefore needed for accurate analysis of the reverse recovery characteristics. The current reduction rate increases up to 2 kA/μs because of low stray inductance. The maximum reverse voltage during the reverse recovery time reaches 8 kV, at which point the drift layer is fully depleted. The carrier lifetime at the high level injection is 0.086 μs at room temperature and reaches 0.53 μs at 250 °C.


2005 ◽  
Vol 52 (6) ◽  
pp. 2345-2352 ◽  
Author(s):  
P. Paillet ◽  
M. Gaillardin ◽  
V. Ferlet-Cavrois ◽  
A. Torres ◽  
O. Faynot ◽  
...  

2007 ◽  
Vol 54 (6) ◽  
pp. 2174-2180 ◽  
Author(s):  
Philippe C. Adell ◽  
Hugh J. Barnaby ◽  
Ron D. Schrimpf ◽  
Bert Vermeire

2019 ◽  
Vol 23 (1) ◽  
pp. 337-344 ◽  
Author(s):  
D. Vasileska ◽  
K. Ralevab ◽  
S. M. Goodnick

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