Electrical modeling and simulation challenges in chip-package codesign

IEEE Micro ◽  
1998 ◽  
Vol 18 (4) ◽  
pp. 50-59 ◽  
Author(s):  
A.C. Cangellaris
2013 ◽  
Vol 19 (3) ◽  
pp. 18-22 ◽  
Author(s):  
Heidi K. Thornquist ◽  
Eric R. Keiter ◽  
Sivasankaran Rajamanickam

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