Process induced residual stresses in isotropically conductive adhesive joints

S.X. Wu;  Yuhai Mel;  Chao-Pin Yeh; K.W. Wyatt

doi:10.1109/3476.558551

Process induced residual stresses in isotropically conductive adhesive joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part C ◽

10.1109/3476.558551 ◽

1996 ◽

Vol 19 (4) ◽

pp. 251-256 ◽

Cited By ~ 10

Author(s):

S.X. Wu ◽

Yuhai Mel ◽

Chao-Pin Yeh ◽

K.W. Wyatt

Keyword(s):

Residual Stresses ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Isotropically Conductive Adhesive

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Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) ◽

10.1109/adhes.1998.742006 ◽

2002 ◽

Cited By ~ 3

Author(s):

J.H. Constable ◽

T. Kache ◽

H. Teichmann ◽

S. Muhle ◽

M.A. Gaynes

Keyword(s):

Fatigue Life ◽

Electrical Resistance ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Resistance Monitoring ◽

Pull Strength ◽

Isotropically Conductive Adhesive

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Electrical resistance modeling of isotropically conductive adhesive joints

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. ◽

10.1109/isse.2005.1491016 ◽

2005 ◽

Cited By ~ 5

Author(s):

M. Mundlein ◽

J. Nicolics

Keyword(s):

Electrical Resistance ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Isotropically Conductive Adhesive ◽

Resistance Modeling

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Reliability assessment of isotropically conductive adhesive joints surface mount applications

Microelectronics Reliability ◽

10.1016/0026-2714(96)84466-0 ◽

1996 ◽

Vol 36 (4) ◽

pp. 553

Keyword(s):

Reliability Assessment ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Surface Mount ◽

Isotropically Conductive Adhesive

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Electrical conduction models for isotropically conductive adhesive joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part A ◽

10.1109/95.558537 ◽

1997 ◽

Vol 20 (1) ◽

pp. 3-8 ◽

Cited By ~ 64

Author(s):

L. Li ◽

J.E. Morris

Keyword(s):

Electrical Conduction ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Isotropically Conductive Adhesive

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Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/6144.774731 ◽

1999 ◽

Vol 22 (2) ◽

pp. 191-199 ◽

Cited By ~ 36

Author(s):

J.H. Constable ◽

T. Kache ◽

H. Teichmann ◽

S. Muhle ◽

M.A. Gaynes

Keyword(s):

Fatigue Life ◽

Electrical Resistance ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Resistance Monitoring ◽

Pull Strength ◽

Isotropically Conductive Adhesive

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Reliability assessment of isotropically conductive adhesive joints in surface mount applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.386266 ◽

1995 ◽

Vol 18 (2) ◽

pp. 305-312 ◽

Cited By ~ 32

Author(s):

R.S. Rorgren ◽

Johan Liu

Keyword(s):

Reliability Assessment ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Surface Mount ◽

Isotropically Conductive Adhesive

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Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints

IEEE Transactions on Advanced Packaging ◽

10.1109/6040.883767 ◽

2000 ◽

Vol 23 (4) ◽

pp. 743-749 ◽

Cited By ~ 20

Author(s):

J. Liu ◽

Z. Lai ◽

J.B. Nysaether

Keyword(s):

Thermal Cycling ◽

Flip Chip ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Solder Bumps ◽

Isotropically Conductive Adhesive

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Development of thermoplastic isotropically conductive adhesive

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927788 ◽

2002 ◽

Cited By ~ 13

Author(s):

S. Liong ◽

C.P. Wong

Keyword(s):

Conductive Adhesive ◽

Isotropically Conductive Adhesive

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Sensitivity of resistance, noise and nonlinearity of conductive adhesive joints to changes in adhesive

2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME) ◽

10.1109/siitme.2016.7777239 ◽

2016 ◽

Author(s):

Seba Barto ◽

Pavel Mach

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Resistance Noise

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J031043 Accelerated Thermal Fatigue Life Testing of Electrically Conductive Adhesive Joints

The Proceedings of Mechanical Engineering Congress Japan ◽

10.1299/jsmemecj.2011._j031043-1 ◽

2011 ◽

Vol 2011 (0) ◽

pp. _J031043-1-_J031043-4

Author(s):

Yasuhisa FUJIMOTO ◽

Yasumi UEGAI

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Life Testing ◽

Electrically Conductive ◽

Thermal Fatigue Life ◽

Electrically Conductive Adhesive

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