CMOS-compatible planar silicon waveguide-grating-coupler photodetectors fabricated on silicon-on-insulator (SOI) substrates

2002 ◽  
Vol 38 (5) ◽  
pp. 477-480 ◽  
Author(s):  
S.M. Csutak ◽  
S. Dakshina-Murthy ◽  
J.C. Campbell
2013 ◽  
Vol 21 (7) ◽  
pp. 7868 ◽  
Author(s):  
Chao Li ◽  
Huijuan Zhang ◽  
Mingbin Yu ◽  
G. Q. Lo

2002 ◽  
Vol 38 (2) ◽  
pp. 193-196 ◽  
Author(s):  
S.M. Csutak ◽  
J.D. Schaub ◽  
W.E. Wu ◽  
R. Shimer ◽  
J.C. Campbell

2018 ◽  
Author(s):  
Yang Gao ◽  
Yanfei Liu ◽  
Jiali Liao ◽  
Jun Xu ◽  
Zhanrong Zhou ◽  
...  

2018 ◽  
Vol 57 (12) ◽  
pp. 3301 ◽  
Author(s):  
Jianxun Hong ◽  
Feng Qiu ◽  
Andrew M. Spring ◽  
Shiyoshi Yokoyama

2016 ◽  
Vol 41 (4) ◽  
pp. 820 ◽  
Author(s):  
Liu Liu ◽  
Jianhao Zhang ◽  
Chenzhao Zhang ◽  
Siya Wang ◽  
Chichao Jin ◽  
...  

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Hongqiang Li ◽  
Yaoting Bai ◽  
Xiaye Dong ◽  
Enbang Li ◽  
Yang Li ◽  
...  

Four methods based on a multimode interference (MMI) structure are optimally designed to flatten the spectral response of silicon-on-insulator- (SOI-) based arrayed-waveguide grating (AWG) applied in a demodulation integration microsystem. In the design for each method, SOI is selected as the material, the beam propagation method is used, and the performances (including the 3 dB passband width, the crosstalk, and the insertion loss) of the flat-top AWG are studied. Moreover, the output spectrum responses of AWGs with or without a flattened structure are compared. The results show that low insertion loss, crosstalk, and a flat and efficient spectral response are simultaneously achieved for each kind of structure. By comparing the four designs, the design that combines a tapered MMI with tapered input/output waveguides, which has not been previously reported, was shown to yield better results than others. The optimized design reduced crosstalk to approximately −21.9 dB and had an insertion loss of −4.36 dB and a 3 dB passband width, that is, approximately 65% of the channel spacing.


Author(s):  
T. Signamarcheix ◽  
B. Biasse ◽  
A-M. Papon ◽  
E. Nolot ◽  
B. Ghyselen ◽  
...  

2004 ◽  
Vol 29 (23) ◽  
pp. 2749 ◽  
Author(s):  
Dirk Taillaert ◽  
Peter Bienstman ◽  
Roel Baets

2009 ◽  
Vol 156-158 ◽  
pp. 101-106 ◽  
Author(s):  
Douglas M. Jordan ◽  
Kanad Mallik ◽  
Robert J. Falster ◽  
Peter R. Wilshaw

The concept of fully encapsulated, semi-insulating silicon (SI-Si), Czochralski-silicon-on-insulator (CZ-SOI) substrates for silicon microwave devices is presented. Experimental results show that, using gold as a compensating impurity, a Si resistivity of order 400 kΩcm can be achieved at room temperature using lightly phosphorus doped substrates. This compares favourably with the maximum of ~180kΩcm previously achieved using lightly boron doped wafers and is due to a small asymmetry of the position of the two gold energy levels introduced into the band gap. Measurements of the temperature dependence of the resistivity of the semi-insulating material show that a resistivity ~5kΩcm can be achieved at 100°C. Thus the substrates are suitable for microwave devices working at normal operating temperatures and should allow Si to be used for much higher frequency microwave applications than currently possible.


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