Spatially modulated light detector in CMOS with sense-amplifier receiver operating at 180 Mb/s for optical data link applications and parallel optical interconnects between chips

1998 ◽  
Vol 4 (6) ◽  
pp. 1040-1045 ◽  
Author(s):  
M. Kuijk ◽  
D. Coppee ◽  
R. Vounckx
1999 ◽  
Vol 43 (3) ◽  
pp. 609-613 ◽  
Author(s):  
Daniël Coppée ◽  
Wei Pan ◽  
Johan Stiens ◽  
Roger Vounckx ◽  
Maarten Kuijk

1991 ◽  
Vol 113 (3) ◽  
pp. 258-262 ◽  
Author(s):  
J. G. Stack ◽  
M. S. Acarlar

The reliability and life of an Optical Data Link transmitter are inversely related to the temperature of the LED. It is therefore critical to have efficient packaging from the point of view of thermal management. For the ODL® 200H devices, it is also necessary to ensure that all package seals remain hermetic throughout the stringent military temperature range requirements of −65 to +150°C. For these devices, finite element analysis was used to study both the thermal paths due to LED power dissipation and the thermally induced stresses in the hermetic joints due to ambient temperature changes


Author(s):  
T. Yoshikawa ◽  
S. Araki ◽  
K. Miyoshi ◽  
N. Henmi ◽  
Y. Suemura ◽  
...  
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