High temperature electronics application in well logging

R.K. Traeger; P.C. Lysne

doi:10.1109/23.12845

High temperature electronics application in well logging

IEEE Transactions on Nuclear Science ◽

10.1109/23.12845 ◽

1988 ◽

Vol 35 (1) ◽

pp. 852-854 ◽

Cited By ~ 16

Author(s):

R.K. Traeger ◽

P.C. Lysne

Keyword(s):

High Temperature ◽

Well Logging ◽

High Temperature Electronics

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Present and Future Needs in High Temperature Electronics for the Well Logging Industry

High-Temperature Electronics ◽

10.1109/9780470544884.ch15 ◽

2009 ◽

Keyword(s):

High Temperature ◽

Well Logging ◽

High Temperature Electronics ◽

Future Needs ◽

Logging Industry

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High temperature electronics for geothermal well-logging applications. Proceedings of a workshop held at the University of Arizona, April 28, 1978

10.2172/5716184 ◽

1978 ◽

Author(s):

L.S. Raymond

Keyword(s):

High Temperature ◽

Well Logging ◽

Geothermal Well ◽

High Temperature Electronics ◽

University Of Arizona ◽

The University

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High Temperature Electronics Assessment.

10.21236/ada291853 ◽

1993 ◽

Author(s):

S. J. Yakura

Keyword(s):

High Temperature ◽

High Temperature Electronics

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High-Temperature Electronics in Europe

10.21236/ada399754 ◽

2000 ◽

Author(s):

Vladimir Dmitriev ◽

T. P. Chow ◽

Steven P. DenBaars ◽

Michael S. Shur ◽

Michael G. Spencer

Keyword(s):

High Temperature ◽

High Temperature Electronics

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Diamond switches for high temperature electronics

IECEC-97 Proceedings of the Thirty-Second Intersociety Energy Conversion Engineering Conference (Cat. No.97CH6203) ◽

10.1109/iecec.1997.659204 ◽

2002 ◽

Author(s):

G.M. Loubriel ◽

F.J. Zutavern ◽

M.H. Ruebush ◽

D.J. Brown ◽

M.W. O'Malley ◽

...

Keyword(s):

High Temperature ◽

High Temperature Electronics

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New Accelerating Test Methods for Board Level Solder Joints and Thermal Caused Failure Mechanisms in High Temperature Electronics

2006 1st Electronic Systemintegration Technology Conference ◽

10.1109/estc.2006.279996 ◽

2006 ◽

Cited By ~ 1

Author(s):

Wolfgang Neher

Keyword(s):

High Temperature ◽

Solder Joints ◽

Failure Mechanisms ◽

Test Methods ◽

High Temperature Electronics ◽

Board Level

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High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology

2009 2nd International Conference on Adaptive Science & Technology (ICAST) ◽

10.1109/icastech.2009.5409731 ◽

2009 ◽

Cited By ~ 9

Author(s):

E.H. Amalu ◽

N.N. Ekere ◽

R. S. Bhatti

Keyword(s):

High Temperature ◽

High Temperature Electronics

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A review of high-temperature electronics technology and applications

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-015-3459-4 ◽

2015 ◽

Vol 26 (12) ◽

pp. 9226-9235 ◽

Cited By ~ 61

Author(s):

Jeff Watson ◽

Gustavo Castro

Keyword(s):

High Temperature ◽

High Temperature Electronics

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High temperature electronics based on compound semiconductors

High Temperature Electronics ◽

10.1007/978-1-4613-1197-3_6 ◽

1997 ◽

pp. 161-172

Author(s):

H. L. Hartnagel

Keyword(s):

High Temperature ◽

Compound Semiconductors ◽

High Temperature Electronics

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Overview of High Temperature Electronics

High Temperature Electronics ◽

10.1201/9780203751978-1 ◽

2018 ◽

pp. 1-5 ◽

Cited By ~ 1

Keyword(s):

High Temperature ◽

High Temperature Electronics

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