Parallel-plate mode reduction in conductor-backed slots using electromagnetic bandgap substrates

1999 ◽  
Vol 47 (11) ◽  
pp. 2099-2104 ◽  
Author(s):  
J.D. Shumpert ◽  
W.J. Chappell ◽  
L.P.B. Katehi
Electronics ◽  
2019 ◽  
Vol 8 (6) ◽  
pp. 719
Author(s):  
Myunghoi Kim

In this study, we propose and analyze a dual-perforation (DP) technique to improve an electromagnetic bandgap (EBG) structure in thin and low-cost printed circuit boards (PCBs). The proposed DP–EBG structure includes a power plane with a square aperture and a patch with an L-shape slot that overcomes efficiently the problems resulting from the low-inductance and the characteristic impedance of the EBG structure developed for parallel-plate noise suppression in thin PCBs. The effects of the proposed dual-perforation technique on the stopband characteristics and unit cell size are analyzed using an analytical dispersion method and full-wave simulations. The closed-form expressions for the main design parameters of the proposed DP–EBG structure are extracted as a design guide. It is verified based on full-wave simulations and measurements that the DP technique is a cost-effective method that can be used to achieve a size reduction and a stopband extension of the EBG structure in thin PCBs. For the same unit cell size and low cut-off frequency, the DP–EBG structure increases the stopband bandwidth by up to 473% compared to an inductance-enhanced EBG structure. In addition, the unit cell size is substantially reduced by up to 94.2% compared to the metallo–dielectric EBG structure. The proposed DP–EBG technique achieves the wideband suppression of parallel plate noise and miniaturization of the EBG structure in thin and low-cost PCBs.


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