Equivalent-circuit modeling and verification of metal-ceramic packages for RF and microwave power transistors
1999 ◽
Vol 47
(6)
◽
pp. 709-714
◽
1999 ◽
Vol 14
(4)
◽
pp. 982-988
◽
Keyword(s):
Keyword(s):
2021 ◽
1979 ◽
Vol 27
(5)
◽
pp. 415-422
◽