Study of clock head/disk interface failure mechanism in servo-writing process

1998 ◽  
Vol 34 (4) ◽  
pp. 1723-1725 ◽  
Author(s):  
Bo Liu ◽  
Gang Sheng ◽  
Qisuo Chen ◽  
Qingfang Leng ◽  
C.T. Yeo ◽  
...  
Keyword(s):  
Failure Mechanism ◽  
Writing Process ◽  
Head Disk Interface ◽  
Interface Failure ◽  
Disk Interface

Effect of particulate contamination on the friction and wear of a magnetic head-rigid disk interface

2000 ◽  
Vol 214 (5) ◽  
pp. 493-505 ◽  
Author(s):  
S Chandra ◽  
B Bhushan
Keyword(s):  
Failure Mechanism ◽  
Friction And Wear ◽  
Particle Concentration ◽  
Damage Mechanism ◽  
Flying Height ◽  
Head Disk Interface ◽  
Magnetic Head ◽  
Disk Interface ◽  
Particulate Contamination ◽  
Rigid Disks

Particulate contamination studies were carried out with laser-textured and mechanically textured magnetic rigid disks and nanosliders. The effects of particle concentration and its size, particle material, duration of exposure to contamination, interface speed and disk textures were studied. The head-disk interface (HDI) durability increased as particle concentration decreased. The effect of different hard-particle materials was attributed to how easily it can form agglomerates. Data indicate that limited-time exposure to a class 10 000 environment will not deter tribological performance of the HDI. In a contaminated environment, head flying in the data zone exhibited higher durability than that in the-lase textured zone. However, the mechanically textured disk and the data zone of laser-textured disks showed comparable durability in the presence of contamination. The HDI damage mechanism and pattern changed as the disk speed changed. A failure mechanism to show how the airborne particles interact with the interface is presented. The effects of the HDI geometry, flying height, pitch angle which controls the air flow pattern govern the failure mechanism in the flying mode.

A study of the head disk interface shock failure mechanism

1994 ◽  
Vol 30 (6) ◽  
pp. 4155-4157 ◽  
Author(s):  
S. Kumar ◽  
V.D. Khanna ◽  
M. Sri-Jayantha
Keyword(s):  
Failure Mechanism ◽  
Head Disk Interface ◽  
Disk Interface

Track seeking, head-disk spacing variation and head-disk interface failure

1997 ◽  
Vol 33 (5) ◽  
pp. 3136-3138 ◽  
Author(s):  
Bo Liu ◽  
Qisuo Chen ◽  
Zhimin Yuan ◽  
Gang Sheng
Keyword(s):  
Head Disk Interface ◽  
Interface Failure ◽  
Disk Interface ◽  
Spacing Variation ◽  
Disk Spacing

Flyability Failures Due to Organic Siloxanes at the Head/Disk Interface

1999 ◽  
Vol 122 (2) ◽  
pp. 444-449 ◽  
Author(s):  
Vedantham Raman ◽  
Donald Gillis ◽  
Reinhard Wolter
Keyword(s):  
Adhesive Tape ◽  
Head Disk Interface ◽  
Recording Industry ◽  
Interface Failure ◽  
Disk Interface ◽  
Release Liner ◽  
Volatile Materials ◽  
Full Body

With the trend toward lower flying heights and increasing storage capacity in the magnetic recording industry, the role of contamination and methods to counteract its deleterious effects are expected to become important. One area where the role of contaminants is expected to increasingly affect reliability is long term flyability. This is because volatile and semi-volatile materials in the drive can alter the flying characteristics of the slider during operation because of chemistry at the interface. In this paper, we describe the flyability performance of a head-disk interface system using full body capacitance measurements as a monitor of interface reliability. The principal features observed in flyability tests employing two sources of siloxanes, a model organic compound octamethylcyclotetrasiloxane as well as outgassing from an exposed adhesive tape with a release liner, are described. The deleterious effects of siloxane outgassing that lead to changes in the flying characteristics of the slider and subsequent interface failure are described for disks lubricated with Fomblin Z-dol. Chemical identification of the accumulated material on the slider following flyability testing is described. Strikingly different performance is observed for disks lubricated with the cyclic phosphazene X-1P which shows significantly improved flyability performance. Possible mechanisms that lead to the formation of silica at the head-disk interface for Z-dol based disks and reasons for their absence for an X-1P interface are discussed. [S0742-4787(00)01202-9]

Investigation of High Frequency Failures on a 0.35μm CMOS IC

1999 ◽  
Author(s):  
Alan Kennen ◽  
John F. Guravage ◽  
Lauren Foster ◽  
John Kornblum
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Integrated Circuit ◽  
Metal Layer ◽  
Ion Beam ◽  
Stress Test ◽  
Design For Test ◽  
Interface Failure ◽  
Serial Interface ◽  
High Impedance

Abstract Rapidly changing technology highlights the necessity of developing new failure analysis methodologies. This paper will discuss the combination of two techniques, Design for Test (DFT) and Focused Ion Beam (FIB) analysis, as a means for successfully isolating and identifying a series of high impedance failure sites in a 0.35 μm CMOS design. Although DFT was designed for production testing, the failure mechanism discussed in this paper may not have been isolated without this technique. The device of interest is a mixed signal integrated circuit that provides a digital up-convert function and quadrature modulation. The majority of the circuit functions are digital and as such the majority of the die area is digital. For this analysis, Built In Self Test (BIST) circuitry, an evaluation board for bench testing and FIB techniques were used to successfully identify an unusual failure mechanism. Samples were subjected to Highly Accelerated Stress Test (HAST) as part of the device qualification effort. Post-HAST electrical testing at 200MHz indicated that two units were non-functional. Several different functional blocks on the chip failed electrical testing. One part of the circuitry that failed was the serial interface. The failure analysis team decided to look at the serial interface failure mode first because of the simplicity of the test. After thorough analysis the FA team discovered increasing the data setup time at the serial port input allowed the device to work properly. SEM and FIB techniques were performed which identified a high impedance connection between a metal layer and the underlying via layer. The circuit was modified using a FIB edit, after which all vectors were read back correctly, without the additional set-up time.

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