Time decay of magnetization in longitudinal CoCrTa/Cr high density thin film media

1997 ◽  
Vol 33 (5) ◽  
pp. 3025-3027 ◽  
Author(s):  
De-Hua Han ◽  
Jian-Gang Zhu ◽  
J.H. Judy ◽  
J.M. Sivertsen
Keyword(s):  
1992 ◽  
Vol 28 (5) ◽  
pp. 3249-3254 ◽  
Author(s):  
E.M.T. Velu ◽  
D.N. Lambeth

2009 ◽  
Vol 6 (1) ◽  
pp. 6-12 ◽  
Author(s):  
Arne Albertsen ◽  
Koji Koiwai ◽  
Kyoji Kobayashi ◽  
Tomonori Oguchi ◽  
Katsumi Aruga

This paper highlights the possible combination of technologies such as thick film screen printing, ink jet, and post-firing thin film processes in conjunction with laser-drilled fine vias to produce high-density, miniaturized LTCC substrates. To obtain the silver pattern on the inner layers, both conventional thick film printing and ink jet printing (using nano silver particle dispersed ink) were applied on the ceramic green sheets. The ink jet process made it possible to metallize fine lines with line/space = 30/30 μm. For interlayer connections, fine vias of 30 μm in diameter formed by UV laser were used. Then these sheets were stacked on top of each other and fired to obtain a base substrate. On this base substrate, fine copper patterns for flip chip mounting were formed by a thin film process. The surface finish consisted of a nickel passivation and a gold layer deposited by electroless plating. The combination of the three patterning processes for conducting traces and UV laser drilling of fine vias make it appear possible to realize fine pitch LTCC, for example, for flip chip device mounting.


1994 ◽  
Vol 75 (10) ◽  
pp. 6129-6131 ◽  
Author(s):  
Tai Min ◽  
Jian‐Gang Zhu

2019 ◽  
Vol 55 (83) ◽  
pp. 12447-12450 ◽  
Author(s):  
Jongmin Lee ◽  
Hongji Yoon ◽  
Seungkyu Kim ◽  
Sehun Seo ◽  
Jaesun Song ◽  
...  

Reliable CuBi2O4/NiO heterostructure thin film photocathodes with high density and sharp interface are demonstrated via pulsed laser deposition.


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