FeN/AlN multilayer films for high moment thin film recording heads

1996 ◽  
Vol 32 (5) ◽  
pp. 3509-3511 ◽  
Author(s):  
K. Sin ◽  
S.X. Wang
Keyword(s):  
Thin Film ◽  
Multilayer Films ◽  
High Moment ◽  
Recording Heads

Improved high moment FeAlN/SiO/sub 2/ laminated materials for thin film recording heads

1991 ◽  
Vol 27 (6) ◽  
pp. 4879-4881 ◽  
Author(s):  
S. Wang ◽  
K.E. Obermyer ◽  
M.H. Kryder
Keyword(s):  
Thin Film ◽  
High Moment ◽  
Recording Heads ◽  
Laminated Materials

Thin film tape recording heads with high moment FeAlN poles

1996 ◽  
Vol 32 (1) ◽  
pp. 166-171 ◽  
Author(s):  
J.A. Bain ◽  
J. Wolfson ◽  
M.H. Kryder ◽  
Yung Yip ◽  
J. Reid ◽  
...  
Keyword(s):  
Thin Film ◽  
High Moment ◽  
Tape Recording ◽  
Recording Heads

Thin Film Tape Recording Heads with High Moment FeAin Poles

2005 ◽  
Author(s):  
J.A. Bain ◽  
J. Wolfson ◽  
M.H. Kryder ◽  
Yung Yip ◽  
J. Reid ◽  
...  
Keyword(s):  
Thin Film ◽  
High Moment ◽  
Tape Recording ◽  
Recording Heads

Fabrication and performance of high moment laminated FeAlN thin film inductive recording heads

1994 ◽  
Vol 30 (2) ◽  
pp. 281-286 ◽  
Author(s):  
S. Wang ◽  
F. Liu ◽  
K.D. Maranowski ◽  
M.N. Kryder
Keyword(s):  
Thin Film ◽  
High Moment ◽  
Recording Heads ◽  
And Performance

Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

1997 ◽  
Vol 473 ◽  
Author(s):  
H. S. Yang ◽  
F. R. Brotzen ◽  
D. L. Callahan ◽  
C. F. Dunn
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Distribution Function ◽  
Quantitative Measurement ◽  
Multilayer Films ◽  
Adhesion Testing ◽  
Novel Technique ◽  
Electrostatic Adhesion ◽  
Scanning Electron

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

Non-uniform response in the pole tips of thin film recording heads

1987 ◽  
Vol 23 (5) ◽  
pp. 3161-3163 ◽  
Author(s):  
M. Re ◽  
R. Katti ◽  
W. Rave ◽  
M. Kryder
Keyword(s):  
Thin Film ◽  
Recording Heads
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