Relation between microstructure of grain boundary and the intergranular exchange in CoCrTa thin film for longitudinal recording media

1994 ◽  
Vol 30 (6) ◽  
pp. 3969-3971 ◽  
Author(s):  
J. Nakai ◽  
E. Kusumoto ◽  
M. Kuwabara ◽  
T. Miyamoto ◽  
M.R. Visokay ◽  
...  
1994 ◽  
Vol 18 (S_1_PMRC_94_1) ◽  
pp. S1_467-470
Author(s):  
Michinobu SUEKANE ◽  
Masao MIYAMURA

1994 ◽  
Vol 18 (S_1_PMRC_94_1) ◽  
pp. S1_141-144 ◽  
Author(s):  
Toshikazu NISHIHARA ◽  
Toshiro ABE ◽  
Toshio ANDO ◽  
Makoto MIZUKAMI ◽  
Masaru SEGAWA

1998 ◽  
Vol 517 ◽  
Author(s):  
J.E. Wittig ◽  
T.P. Nolan ◽  
R. Sinclair ◽  
J. Bentley

AbstractThe current study of CoCr12Ta4/Cr longitudinal recording media combines high resolution electron microscopy (HRTEM) with nanoprobe energy dispersive spectroscopy (EDS) and energy-filtered imaging (EFTEM) to correlate the Cr distribution with specific microstructural features. EFTEM images show Cr enrichment at grain boundaries, both random angle boundaries and 90° bicrystal boundaries. Cr segregation within grains is also observed in the elemental maps. This intragrain segregation often occurs at a series of defects that may define separately nucleated grains having 00 misorientation. Nanoprobe EDS measurements indicate that these defects contain localized concentrations of 25 to 30 % Cr. The random angle grain boundary Cr concentration occurs with a wide range, 19 to 36 at% (mean 22%) whereas the more crystallographically related 900 boundaries contain less Cr with less variation, 15 to 21 at% (mean 17% Cr). Composition profiles across grain boundaries using both nanoprobe EDS and EFTEM images show the full-width-half-maximum of the segregation to be approximately 4 nm, with Cr depleted regions next to the grain boundary having less than 7 at% Cr. The Ta concentration revealed no statistical evidence of segregation.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
G.A. Bertero ◽  
R. Sinclair

Pt/Co multilayers displaying perpendicular (out-of-plane) magnetic anisotropy and 100% perpendicular remanent magnetization are strong candidates as magnetic media for the next generation of magneto-optic recording devices. The magnetic coercivity, Hc, and uniaxial anisotropy energy, Ku, are two important materials parameters, among others, in the quest to achieving higher recording densities with acceptable signal to noise ratios (SNR). The relationship between Ku and Hc in these films is not a simple one since features such as grain boundaries, for example, can have a strong influence on Hc but affect Ku only in a secondary manner. In this regard grain boundary separation provides a way to minimize the grain-to-grain magnetic coupling which is known to result in larger coercivities and improved SNR as has been discussed extensively in the literature for conventional longitudinal recording media.We present here results from the deposition of two Pt/Co/Tb multilayers (A and B) which show significant differences in their coercive fields.


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