The smart power high-side switch: description of a specific technology, its basic devices, and monitoring circuitries

1990 ◽  
Vol 37 (4) ◽  
pp. 1154-1161 ◽  
Author(s):  
A. Elmoznine ◽  
J. Buxo ◽  
M. Bafleur ◽  
P. Rossel
Keyword(s):  
Smart Power ◽  
High Side ◽  
Specific Technology

Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design

2020 ◽  
Vol 2020 (1) ◽  
pp. 000015-000020
Author(s):  
Min Chu ◽  
Jie Chen ◽  
Abidur Rahman ◽  
Rajen Murugan
Keyword(s):  
Electrical Performance ◽  
Diagnostic Feature ◽  
Electromagnetic Modeling ◽  
Smart Power ◽  
Modeling Methodology ◽  
Power Switch ◽  
High Side ◽  
Die Attach ◽  
Power Switches ◽  
The Impact

Abstract Generally, IC packages with exposed pads have excellent thermal and electrical performance – assuming high fidelity and integrity of die attach material. However, reliability challenges associated with die attach impacts electrical performance of vertical power FETs for high-side power switches. As such, it is critical to quantify the impact of these challenges on high-side power switches operation, so that their protection and diagnostic feature circuitries can be properly designed for mission critical applications. In this paper we present on a package and PCB co-modeling methodology that was developed to assess impact of die attach integrity on performance of high-side power switch designs. We explain how electrical co-optimization of the system (viz. FET-Package-PCB) interactions, was achieved through a coupled circuit-to-electromagnetic modeling, simulation, and analysis methodology. Silicon laboratory measurements data that validate the modeling methodology will be presented.

EMC Robust Design for Smart Power High Side Switches

2011 ◽  
pp. 89-104
Author(s):  
Paolo Del Croce ◽  
Bernd Deutschmann
Keyword(s):  
Robust Design ◽  
Smart Power ◽  
High Side

Smart power high-side switch technology for low-voltage automotive applications

1990 ◽  
Author(s):  
Marise Bafleur ◽  
J. Buxo ◽  
A. Elmoznine ◽  
P. Rossel
Keyword(s):  
Low Voltage ◽  
Automotive Applications ◽  
Smart Power ◽  
High Side

scholarly journals Application of a floating well concept to a latch-up-free, low-cost, smart power high-side switch technology

1993 ◽  
Vol 40 (7) ◽  
pp. 1340-1342 ◽  
Author(s):  
M. Bafleur ◽  
J. Buxo ◽  
M.P. Vidal ◽  
P. Givelin ◽  
V. Macary ◽  
...  
Keyword(s):  
Low Cost ◽  
Smart Power ◽  
High Side ◽  
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